Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
Internal Part Number | EIS-M2S150T-1FCVG484 | |
Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
Production Status (Lifecycle) | In Production | |
Condition | New & Unused, Original Sealed | |
PCN Design/Specification | Multiple Changes 17/Sep/2015 | |
Standard Package | 84 | |
Category | Integrated Circuits (ICs) | |
Family | Embedded - System On Chip (SoC) | |
Series | SmartFusion®2 | |
Packaging | Tray | |
Architecture | MCU, FPGA | |
Core Processor | ARM® Cortex®-M3 | |
MCU Flash | 512KB | |
MCU RAM | 64KB | |
Peripherals | DDR, PCIe, SERDES | |
Connectivity | CAN, Ethernet, I²C, SPI, UART/USART, USB | |
Speed | 166MHz | |
Primary Attributes | FPGA - 150K Logic Modules | |
Operating Temperature | 0°C ~ 85°C | |
Package / Case | 484-BFBGA | |
Supplier Device Package | 484-BGA | |
Number of I/O | 273 | |
Weight | 0.001 KG | |
Application | Email for details | |
Alternative Part (Replacement) | M2S150T-1FCVG484 | |
Related Links | M2S150T-, M2S150T-1FCVG484 Datasheet, Microsemi SoC Distributor |
![]() | 3500-100K | FIXED IND 10UH 1A 120 MOHM TH | datasheet.pdf | |
![]() | RT0603CRD0711R5L | RES SMD 11.5OHM 0.25% 1/10W 0603 | datasheet.pdf | |
![]() | TNPW12103K09BEEA | RES SMD 3.09K OHM 0.1% 1/3W 1210 | datasheet.pdf | |
![]() | TNPW1206887RBEEN | RES SMD 887 OHM 0.1% 1/4W 1206 | datasheet.pdf | |
![]() | 0016020088 | CONN SOCKET 22-24AWG CRIMP GOLD | datasheet.pdf | |
![]() | 3835-2 | FUSE BLOCK CART 250V 30A CHASSIS | datasheet.pdf | |
![]() | RNC55H3482FMBSL | RES 34.8K OHM 1/8W 1% AXIAL | datasheet.pdf | |
![]() | 0393740903 | TERM BLOCK PLUG 3POS 90DEG 7.5MM | datasheet.pdf | |
![]() | 77313-457-10LF | HEADER BERGSTIK | datasheet.pdf | |
![]() | 104431-1 | 03 MODII HDR SRRA B/A W/HLDWN | datasheet.pdf | |
![]() | D38999/26TJ61PA | TV 61C 61#20 PIN PLUG | datasheet.pdf | |
![]() | XC9536TM-10PC44I | IC CPLD 36MC 10NS 48CSP | datasheet.pdf |