Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-M3BMK-1060K | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | ||
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| Product Training Modules | Cable Matters | |
| Standard Package | 1 | |
| Category | Cable Assemblies | |
| Family | Rectangular Cable Assemblies | |
| Series | - | |
| Connector Type | Socket to Card Edge | |
| Number of Positions | 10 | |
| Number of Rows | 2 | |
| Pitch - Connector | 0.100" (2.54mm) | |
| Pitch - Cable | 0.050" (1.27mm) | |
| Length | 5.00' (1.52m) | |
| Features | Strain Relief | |
| Color | Multiple, Twisted Pair (Flat) | |
| Shielding | Unshielded | |
| Usage | - | |
| Cable Termination | IDC | |
| Contact Finish | Gold | |
| Contact Finish Thickness | 30µin (0.76µm) | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | M3BMK-1060K | |
| Related Links | M3BMK, M3BMK-1060K Datasheet, 3M Distributor | |
![]() | LTC1440CN8 | IC COMP W/REF LP SINGLE 8-DIP | datasheet.pdf | |
![]() | MCU08050D6980BP500 | RES SMD 698 OHM 0.1% 1/8W 0805 | datasheet.pdf | |
![]() | MCR10EZHF2263 | RES SMD 226K OHM 1% 1/8W 0805 | datasheet.pdf | |
![]() | HUF75343P3 | MOSFET N-CH 55V 75A TO-220AB | datasheet.pdf | |
![]() | R-541.2PA | CONV DC/DC 4A 4.5-18VIN 1.2V | datasheet.pdf | |
![]() | 3-1879657-5 | RES 22.6 OHM 1/2W 0.1% AXIAL | datasheet.pdf | |
![]() | PAC-SYSPOWR1220AT8 | KIT DESIGN SYSTEM ISPAC 1220AT8 | datasheet.pdf | |
![]() | B32529E6223J189 | CAP FILM 0.022UF 5% 400VDC RAD | datasheet.pdf | |
![]() | 9350006-302 | MS2,192,14,20,11,18,11,RT,W8 | datasheet.pdf | |
![]() | 813-S1-012-10-015101 | CONN SPRING LOAD 12POS DUAL PCB | datasheet.pdf | |
![]() | MC-405 32.7680K-AC0: ROHS | CRYSTAL 32.7680 KHZ 9.0PF SMD | datasheet.pdf | |
![]() | 1633079-6 | CRIMPER, INSULATION F | datasheet.pdf |