Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-M3GGK-1660K | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | ||
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| Product Training Modules | Cable Matters | |
| Standard Package | 1 | |
| Category | Cable Assemblies | |
| Family | Rectangular Cable Assemblies | |
| Series | - | |
| Connector Type | Card Edge to Card Edge | |
| Number of Positions | 16 | |
| Number of Rows | 2 | |
| Pitch - Connector | 0.100" (2.54mm) | |
| Pitch - Cable | 0.050" (1.27mm) | |
| Length | 5.00' (1.52m) | |
| Features | Flange | |
| Color | Multiple, Twisted Pair (Flat) | |
| Shielding | Unshielded | |
| Usage | - | |
| Cable Termination | IDC | |
| Contact Finish | Gold | |
| Contact Finish Thickness | 30µin (0.76µm) | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | M3GGK-1660K | |
| Related Links | M3GGK, M3GGK-1660K Datasheet, 3M Distributor | |
![]() | BFC241674304 | CAP FILM 0.43UF 2% 63VDC RADIAL | datasheet.pdf | |
![]() | MC908QY4MDWER | IC MCU 8BIT 4KB FLASH 16SOIC | datasheet.pdf | |
![]() | EBM40DCWN | CONN EDGECARD 80POS DIP .156 SLD | datasheet.pdf | |
![]() | TL7726IDRG4 | IC HEX CLAMPING CIRCUIT 8-SOIC | datasheet.pdf | |
![]() | RER70F8R25RCSL | RES CHAS MNT 8.25 OHM 1% 20W | datasheet.pdf | |
![]() | 5SGSMD3H2F35I3N | IC FPGA 432 I/O 1152FBGA | datasheet.pdf | |
![]() | 10053565-912002LF | CONN MOD JACK 6P4C R/A UNSHLD | datasheet.pdf | |
![]() | ATS-10F-143-C1-R0 | HEATSINK 30X30X20MM L-TAB | datasheet.pdf | |
![]() | BAW56-HE3-18 | DIODE ARRAY GP 70V 250MA SOT23 | datasheet.pdf | |
![]() | 2420/31 BK-1000 | ULTRA-FLEX FEP 31 AWG 1000 FT BK | datasheet.pdf | |
![]() | H131CGCL-140 | LED ASSY RA 3MM GRN WATER CLEAR | datasheet.pdf | |
![]() | CTVP00RW-25-187SB-LC | HD 38999 187C 187#23 SKT RECP | datasheet.pdf |