Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-M58BW016FB7T3F | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| Standard Package | 1 | |
| Category | Integrated Circuits (ICs) | |
| Family | Memory | |
| Series | - | |
| Packaging | Cut Tape (CT) | |
| Format - Memory | FLASH | |
| Memory Type | FLASH - NOR | |
| Memory Size | 16M (512K x 32) | |
| Speed | 70ns | |
| Interface | Parallel | |
| Voltage - Supply | 2.7 V ~ 3.6 V | |
| Operating Temperature | -40°C ~ 125°C | |
| Package / Case | 80-BQFP | |
| Supplier Device Package | 80-PQFP (19.9x13.9) | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | M58BW016FB7T3F | |
| Related Links | M58BW01, M58BW016FB7T3F Datasheet, Micron Technology Distributor | |
![]() | RP1608S-150-F | RES SMD 15 OHM 1% 1/5W 0603 | datasheet.pdf | |
![]() | RT0603BRE073KL | RES SMD 3K OHM 0.1% 1/10W 0603 | datasheet.pdf | |
![]() | 350924-6 | CONN PIN 30-26AWG M-N-LOC GOLD | datasheet.pdf | |
![]() | RG1608P-2610-W-T1 | RES SMD 261 OHM 0.05% 1/10W 0603 | datasheet.pdf | |
![]() | GMM03DRKN | CONN EDGECARD 6POS DIP .156 SLD | datasheet.pdf | |
![]() | GMA06DRSD-S288 | CONN EDGECARD 12POS .125 EXTEND | datasheet.pdf | |
![]() | CMF705K6200FKBF | RES 5.62K OHM 1.75W 1% AXIAL | datasheet.pdf | |
![]() | CMF5545K300DHR6 | RES 45.3K OHM 1/2W .5% AXIAL | datasheet.pdf | |
![]() | M20-7833642 | Connector Receptacle 72 Position 0.100" (2.54mm) Gold Through Hole | datasheet.pdf | |
![]() | JP131HBC50RB-L | CABLE JHOOK SUPPORT | datasheet.pdf | |
![]() | ATS-20D-11-C2-R0 | HEATSINK 50X50X10MM XCUT T766 | datasheet.pdf | |
![]() | ATS-03E-89-C2-R0 | HEATSINK 35X35X30MM R-TAB T766 | datasheet.pdf |