Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-M68TQS044SAG1E | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Production Status (Lifecycle) | Obsolete / Discontinued | |
| Condition | New & Unused, Original Sealed | |
| Standard Package | 1 | |
| Category | Programmers, Development Systems | |
| Family | Accessories | |
| Series | - | |
| Accessory Type | Adapter | |
| For Use With/Related Products | Freescale EVAL Boards | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | M68TQS044SAG1E | |
| Related Links | M68TQS0, M68TQS044SAG1E Datasheet, NXP Semiconductors/Freescale Semiconductor, Inc. Distributor | |
![]() | MAX3265CUE | IC AMP LIMITING 2.5GBPS 16-TSSOP | datasheet.pdf | |
![]() | RT0603DRD07432RL | RES SMD 432 OHM 0.5% 1/10W 0603 | datasheet.pdf | |
![]() | EYM10DRMN-S664 | CONN EDGECARD 20POS .156 WW | datasheet.pdf | |
![]() | EDLSD104H5R5C | CAP 100MF 5.5V THROUGH HOLE | datasheet.pdf | |
![]() | VI-23D-CW-F1 | CONVERTER MOD DC/DC 85V 100W | datasheet.pdf | |
![]() | TNPU060351K0AZEN00 | RES SMD 51K OHM 0.05% 1/10W 0603 | datasheet.pdf | |
![]() | E5AC-RX3DSM-808 | CONTROL TEMP/PROC RELAY OUT 24V | datasheet.pdf | |
![]() | 833-87-022-64-001101 | Connector Socket 22 Position 0.079" (2.00mm) Gold Through Hole | datasheet.pdf | |
![]() | GT17HN-4DS-2C(B) | INSULATOR RA CONN 2X2 TYPE | datasheet.pdf | |
![]() | MLG0603P2N7BT000 | FIXED IND 2.7NH 500MA 200 MOHM | datasheet.pdf | |
![]() | 1528012-2 | FA HD-I 5SMPR062F090O BENCH | datasheet.pdf | |
![]() | SC63H/DWH | FUSE CERAMIC | datasheet.pdf |