Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-MAL215729221E3 | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| Standard Package | 50 | |
| Category | Capacitors | |
| Family | Aluminum Capacitors | |
| Series | * | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | MAL215729221E3 | |
| Related Links | MAL2157, MAL215729221E3 Datasheet, Vishay/BCcomponents Distributor | |
![]() | 1-583660-7 | CONN CARDEDGE 18DUAL POS.156GOLD | datasheet.pdf | |
![]() | 389 | CONN ADAPTER 3P-3P F-F IN-LINE | datasheet.pdf | |
![]() | 251R15S2R0BV4E | CAP CER 2PF 250V NP0 0805 | datasheet.pdf | |
![]() | 26PCDFG5G39 | PRESSURE20PC26PC 30 PSI | datasheet.pdf | |
![]() | T495C336K016ATE275 | CAP TANT 33UF 16V 10% 2413 | datasheet.pdf | |
![]() | 8N4QV01KG-1154CDI8 | IC OSC VCXO QD FREQ 10CLCC | datasheet.pdf | |
![]() | ATS-10H-174-C2-R0 | HEATSINK 30X30X35MM R-TAB T766 | datasheet.pdf | |
![]() | ATS-09A-06-C3-R0 | HEATSINK 45X45X10MM XCUT T412 | datasheet.pdf | |
![]() | ATS-12B-32-C1-R0 | HEATSINK 57.9X36.83X11.43MM | datasheet.pdf | |
| IS42RM32800D-75BLI | IC SDRAM 256M 133MHZ 90BGA | datasheet.pdf | ||
![]() | C7018 | JUNCTION BLOCK STUD BLK BASE | datasheet.pdf | |
![]() | XCV600-3BG560I | IC FPGA 316 I/O 432MBGA | datasheet.pdf |