Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
Internal Part Number | EIS-MAX3346EEUD+ | |
Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
Production Status (Lifecycle) | In Production | |
Condition | New & Unused, Original Sealed | |
Product Training Modules | Lead (SnPb) Finish for COTS Long-Term Supply Program | |
EDA / CAD Models | Download from Accelerated Designs | |
Standard Package | 192 | |
Category | Integrated Circuits (ICs) | |
Family | Interface - Drivers, Receivers, Transceivers | |
Series | - | |
Packaging | Tube | |
Type | Transceiver | |
Protocol | USB 2.0 | |
Number of Drivers/Receivers | 1/1 | |
Duplex | Full | |
Receiver Hysteresis | 200mV | |
Data Rate | 12Mbps | |
Voltage - Supply | 4 V ~ 5.5 V | |
Operating Temperature | -40°C ~ 85°C | |
Mounting Type | Surface Mount | |
Package / Case | 14-TSSOP (0.173", 4.40mm Width) | |
Supplier Device Package | 14-TSSOP | |
Weight | 0.001 KG | |
Application | Email for details | |
Alternative Part (Replacement) | MAX3346EEUD+ | |
Related Links | MAX334, MAX3346EEUD+ Datasheet, Maxim Integrated Distributor |
![]() | MVY10VC47RMF55TP | CAP ALUM 47UF 20% 10V SMD | datasheet.pdf | |
![]() | 355-024-521-201 | CARDEDGE 24POS DL .156 LOPRO BLK | datasheet.pdf | |
![]() | SP6641AKEB-3-3 | EVAL BOARD FOR SP6641A 3.3V | datasheet.pdf | |
![]() | XC4VLX15-10FF668I | IC FPGA 320 I/O 668FCBGA | datasheet.pdf | |
![]() | RER70F1271MC02 | RES CHAS MNT 1.27K OHM 1% 20W | datasheet.pdf | |
![]() | 08-012-208 | DIP CABLE M-F 8POS | datasheet.pdf | |
![]() | 1751448 | TERM BLOCK HEADER | datasheet.pdf | |
![]() | ATS-10G-133-C2-R0 | HEATSINK 70X70X10MM XCUT T766 | datasheet.pdf | |
![]() | ATS-20B-84-C3-R0 | HEATSINK 30X30X35MM R-TAB T412 | datasheet.pdf | |
![]() | ATS-05E-85-C1-R0 | HEATSINK 35X35X10MM R-TAB | datasheet.pdf | |
![]() | 68402-206PLF | CONN RCPT 6POS .100" SNG SMD | datasheet.pdf | |
![]() | 4515-DS5B002DP | SENSOR PRESS DIFF | datasheet.pdf |