Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-MB9BF529TBGL-GE1 | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| Product Training Modules | Peripheral Driver Library | |
| Design Resources | Development Tool Selector | |
| Standard Package | 152 | |
| Category | Integrated Circuits (ICs) | |
| Family | Embedded - Microcontrollers | |
| Series | FM3 MB9B520T | |
| Packaging | Tray | |
| Core Processor | ARM® Cortex®-M3 | |
| Core Size | 32-Bit | |
| Speed | 60MHz | |
| Connectivity | CAN, CSIO, EBI/EMI, I²C, LIN, UART/USART, USB | |
| Peripherals | DMA, LVD, POR, PWM, WDT | |
| Number of I/O | 154 | |
| Program Memory Size | 1.5MB (1.5M x 8) | |
| Program Memory Type | FLASH | |
| EEPROM Size | - | |
| RAM Size | 192K x 8 | |
| Voltage - Supply (Vcc/Vdd) | 2.7 V ~ 5.5 V | |
| Data Converters | A/D 24x12b, D/A 2x10b | |
| Oscillator Type | Internal | |
| Operating Temperature | -40°C ~ 105°C | |
| Package / Case | 192-LFBGA | |
| Supplier Device Package | 192-FBGA (12x12) | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | MB9BF529TBGL-GE1 | |
| Related Links | MB9BF529, MB9BF529TBGL-GE1 Datasheet, Spansion Distributor | |
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