Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-MC13211 | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| Product Training Modules | Zigbee Technology Overview ZigBee Development Tools ZigBee Solutions | |
| Design Resources | Development Tool Selector | |
| PCN Design/Specification | MC,SC1321X MCU Die 13/Sep/2013 TJN MAPBGA Molding Compound 23/Sep/2013 Copper Bond Wire 06/Jan/2015 | |
| Standard Package | 260 | |
| Category | RF/IF and RFID | |
| Family | RF Transceiver ICs | |
| Series | - | |
| Packaging | Tray | |
| Type | TxRx + MCU | |
| RF Family/Standard | 802.15.4, ISM | |
| Protocol | Zigbee® | |
| Modulation | O-QPSK | |
| Frequency | 2.4GHz | |
| Data Rate (Max) | 250kbps | |
| Power - Output | 3dBm | |
| Sensitivity | -92dBm | |
| Memory Size | 16kB Flash, 1kB RAM | |
| Serial Interfaces | SPI, UART | |
| GPIO | 32 | |
| Voltage - Supply | 2 V ~ 3.4 V | |
| Current - Receiving | 37mA | |
| Current - Transmitting | 30mA | |
| Operating Temperature | -40°C ~ 85°C | |
| Package / Case | 71-VFLGA | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | MC13211 | |
| Related Links | MC1, MC13211 Datasheet, NXP Semiconductors/Freescale Semiconductor, Inc. Distributor | |
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