Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-MC33790HEG | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| PCN Design/Specification | Copper Wire/Mold Compound Update 31/Oct/2014 Copper Wire Revision A 07/Nov/2014 | |
| EDA / CAD Models | Download from Accelerated Designs | |
| Standard Package | 47 | |
| Category | Integrated Circuits (ICs) | |
| Family | Interface - Sensor and Detector Interfaces | |
| Series | - | |
| Packaging | Tube | |
| Type | Distributed Systems Interface | |
| Input Type | Logic | |
| Output Type | Logic | |
| Interface | SPI | |
| Current - Supply | 1mA | |
| Operating Temperature | -40°C ~ 85°C | |
| Mounting Type | Surface Mount | |
| Package / Case | 16-SOIC (0.295", 7.50mm Width) | |
| Supplier Device Package | 16-SOIC W | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | MC33790HEG | |
| Related Links | MC337, MC33790HEG Datasheet, NXP Semiconductors/Freescale Semiconductor, Inc. Distributor | |
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