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NXP Semiconductors/Freescale Semiconductor, Inc. MC860DECZQ50D4R2

MC860DECZQ50D4R2 picture photo
Mfg. Part Number
MC860DECZQ50D4R2
Manufacturer
Product Category
Embedded - Microprocessors
Brief Description
IC MPU MPC8XX 50MHZ 357BGA
Datasheet Download
MC860DECZQ50D4R2.pdf
Availability of MC860DECZQ50D4R2

Available Quantity

5020 Pieces

Can ship today

Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks

Marketing Price
$ 55.47583
Our Price
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QUANTITY

 

EIS Components is the stocking Distributor of MC860DECZQ50D4R2, we specialize in NXP Semiconductors/Freescale Semiconductor, Inc. all series electronic components. MC860DECZQ50D4R2 can be shipped within 24 hours after order. If you have any demands for MC860DECZQ50D4R2, Please kindly submit an RFQ here or send us an email. We will reply you as soon as possible.
MC860DECZQ50D4R2 Order Process
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Specifications of MC860DECZQ50D4R2
Internal Part NumberEIS-MC860DECZQ50D4R2
Lead Free Status / RoHS StatusContains lead / RoHS non-compliant
Moisture Sensitivity Level (MSL)3 (168 Hours)
Production Status (Lifecycle)In Production
ConditionNew & Unused, Original Sealed
PCN Design/SpecificationCopper Wire Bond Update 01/Aug/2014
Standard Package180
Category Integrated Circuits (ICs)
FamilyEmbedded - Microprocessors
SeriesMPC8xx
PackagingTape & Reel (TR)
Core ProcessorMPC8xx
Number of Cores/Bus Width1 Core, 32-Bit
Speed50MHz
Co-Processors/DSPCommunications; CPM
RAM ControllersDRAM
Graphics AccelerationNo
Display & Interface Controllers-
Ethernet10 Mbps (2)
SATA-
USB-
Voltage - I/O3.3V
Operating Temperature-40°C ~ 95°C
Security Features-
Package / Case357-BBGA
Supplier Device Package357-PBGA (25x25)
Additional InterfacesI²C, IrDA, PCMCIA, SPI, TDM, UART/USART
Weight0.001 KG
ApplicationEmail for details
Alternative Part (Replacement)MC860DECZQ50D4R2
Related LinksMC860DEC, MC860DECZQ50D4R2 Datasheet, NXP Semiconductors/Freescale Semiconductor, Inc. Distributor
MC860DECZQ50D4R2 Details Description
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