Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
Internal Part Number | EIS-MC860ENCZQ50D4R2 | |
Lead Free Status / RoHS Status | Contains lead / RoHS non-compliant | |
Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
Production Status (Lifecycle) | In Production | |
Condition | New & Unused, Original Sealed | |
PCN Design/Specification | Copper Wire Bond Update 01/Aug/2014 | |
Standard Package | 180 | |
Category | Integrated Circuits (ICs) | |
Family | Embedded - Microprocessors | |
Series | MPC8xx | |
Packaging | Tape & Reel (TR) | |
Core Processor | MPC8xx | |
Number of Cores/Bus Width | 1 Core, 32-Bit | |
Speed | 50MHz | |
Co-Processors/DSP | Communications; CPM | |
RAM Controllers | DRAM | |
Graphics Acceleration | No | |
Display & Interface Controllers | - | |
Ethernet | 10 Mbps (4) | |
SATA | - | |
USB | - | |
Voltage - I/O | 3.3V | |
Operating Temperature | -40°C ~ 95°C | |
Security Features | - | |
Package / Case | 357-BBGA | |
Supplier Device Package | 357-PBGA (25x25) | |
Additional Interfaces | I²C, IrDA, PCMCIA, SPI, TDM, UART/USART | |
Weight | 0.001 KG | |
Application | Email for details | |
Alternative Part (Replacement) | MC860ENCZQ50D4R2 | |
Related Links | MC860ENC, MC860ENCZQ50D4R2 Datasheet, NXP Semiconductors/Freescale Semiconductor, Inc. Distributor |
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