Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
Internal Part Number | EIS-MC9S08QG4CFFE | |
Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
Production Status (Lifecycle) | In Production | |
Condition | New & Unused, Original Sealed | |
Product Training Modules | Introduction to MC9S08QG Series of MCUs USBSpyder08 Discovery Kit | |
Design Resources | Development Tool Selector | |
PCN Design/Specification | Multiple Devices Polyimide Removal 09/Jul/2013 Copper Wire Conversion 20/May/2014 Design change04/Sep/2014 Design Change Retraction 16/Sep/2014 QFN 3X3.4X4,5X5 Assembly Site 12/Nov/2015 | |
PCN Assembly/Origin | MC9S08QG8/MC9S08SH8 Assembly Transfer 06/Feb/2014 | |
Standard Package | 4,900 | |
Category | Integrated Circuits (ICs) | |
Family | Embedded - Microcontrollers | |
Series | S08 | |
Packaging | Tray | |
Core Processor | S08 | |
Core Size | 8-Bit | |
Speed | 20MHz | |
Connectivity | I²C, SCI, SPI | |
Peripherals | LVD, POR, PWM, WDT | |
Number of I/O | 12 | |
Program Memory Size | 4KB (4K x 8) | |
Program Memory Type | FLASH | |
EEPROM Size | - | |
RAM Size | 256 x 8 | |
Voltage - Supply (Vcc/Vdd) | 1.8 V ~ 3.6 V | |
Data Converters | A/D 8x10b | |
Oscillator Type | Internal | |
Operating Temperature | -40°C ~ 85°C | |
Package / Case | 16-VQFN Exposed Pad | |
Supplier Device Package | 16-QFN-EP (5x5) | |
Weight | 0.001 KG | |
Application | Email for details | |
Alternative Part (Replacement) | MC9S08QG4CFFE | |
Related Links | MC9S08, MC9S08QG4CFFE Datasheet, NXP Semiconductors/Freescale Semiconductor, Inc. Distributor |
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