Ship from: HONGKONG
								Date Code: Newest Date Code
								Manufacturer lead time 6 weeks
| Internal Part Number | EIS-MC9S08SH8CTJ | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| Product Training Modules | 8-Bit Microcontroller Overview | |
| Design Resources | Development Tool Selector | |
| PCN Design/Specification | Multiple Devices Polyimide Removal 09/Jul/2013 Copper Wire Conversion 20/May/2014 | |
| EDA / CAD Models | Download from Accelerated Designs | |
| Standard Package | 75 | |
| Category | Integrated Circuits (ICs) | |
| Family | Embedded - Microcontrollers | |
| Series | S08 | |
| Packaging | Tube | |
| Core Processor | S08 | |
| Core Size | 8-Bit | |
| Speed | 40MHz | |
| Connectivity | I²C, LIN, SCI, SPI | |
| Peripherals | LVD, POR, PWM, WDT | |
| Number of I/O | 17 | |
| Program Memory Size | 8KB (8K x 8) | |
| Program Memory Type | FLASH | |
| EEPROM Size | - | |
| RAM Size | 512 x 8 | |
| Voltage - Supply (Vcc/Vdd) | 2.7 V ~ 5.5 V | |
| Data Converters | A/D 12x10b | |
| Oscillator Type | Internal | |
| Operating Temperature | -40°C ~ 85°C | |
| Package / Case | 20-TSSOP (0.173", 4.40mm Width) | |
| Supplier Device Package | 20-TSSOP | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | MC9S08SH8CTJ | |
| Related Links | MC9S08, MC9S08SH8CTJ Datasheet, NXP Semiconductors/Freescale Semiconductor, Inc. Distributor | |
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