NXP Semiconductors/Freescale Semiconductor, Inc. MC9S12D32MFUE
- Mfg. Part Number
- MC9S12D32MFUE
- Manufacturer
- NXP Semiconductors/Freescale Semiconductor, Inc.
- Product Category
- Embedded - Microcontrollers
- Brief Description
- IC MCU 16BIT 32KB FLASH 80QFP
- Datasheet Download
- MC9S12D32MFUE.pdf
Availability of MC9S12D32MFUE
Available Quantity
5327 Pieces
Can ship today
Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
- Marketing Price
- $ 7.60800
- Our Price
- Quote by Email
EIS Components is the stocking Distributor of MC9S12D32MFUE, we specialize in NXP Semiconductors/Freescale Semiconductor, Inc. all series electronic components. MC9S12D32MFUE can be shipped within 24 hours after order. If you have any demands for MC9S12D32MFUE, Please kindly submit an RFQ here or send us an email. We will reply you as soon as possible.
- MC9S12D32MFUE Order Process
- Add Parts to RFQ form
- Submit RFQ
- We reply within 24 hours
- You confirm order
- Payment
- Ship out your order
Specifications of
MC9S12D32MFUE
| Internal Part Number | EIS-MC9S12D32MFUE | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| Design Resources | Development Tool Selector | |
| PCN Design/Specification | Copper Wire Conversion 20/May/2014 | |
| Standard Package | 840 | |
| Category | Integrated Circuits (ICs) | |
| Family | Embedded - Microcontrollers | |
| Series | HCS12 | |
| Packaging | Tray | |
| Core Processor | HCS12 | |
| Core Size | 16-Bit | |
| Speed | 25MHz | |
| Connectivity | CAN, I²C, SCI, SPI | |
| Peripherals | PWM, WDT | |
| Number of I/O | 59 | |
| Program Memory Size | 32KB (32K x 8) | |
| Program Memory Type | FLASH | |
| EEPROM Size | 1K x 8 | |
| RAM Size | 4K x 8 | |
| Voltage - Supply (Vcc/Vdd) | 2.35 V ~ 5.25 V | |
| Data Converters | A/D 8x10b | |
| Oscillator Type | Internal | |
| Operating Temperature | -40°C ~ 125°C | |
| Package / Case | 80-QFP | |
| Supplier Device Package | 80-QFP (14x14) | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | MC9S12D32MFUE | |
| Related Links | MC9S12, MC9S12D32MFUE Datasheet, NXP Semiconductors/Freescale Semiconductor, Inc. Distributor | |
MC9S12D32MFUE Details Description
Related parts for MC9S12D32MFUE
 | ECW-U1564KCV | CAP FILM 0.56UF 10% 100VDC 3925 | datasheet.pdf | |
 | LAL03TA470K | FIXED IND 47UH 110MA 4.9 OHM TH | datasheet.pdf | |
| RYM22DRSN | CONN EDGECARD 44POS DIP .156 SLD | datasheet.pdf | |
| ST12T1M4ZQE | SWITCH TOGGLE SPDT 6A 125V | datasheet.pdf | |
 | 7M-16.000MEEQ-T | Crystal 16.0000MHz 10ppm 10pF 80 Ohm -20°C - 70°C Surface Mount 4-SMD, No Lead (DFN, LCC) | datasheet.pdf | |
.jpg) | GQM2195C1H910GB01D | CAP CER 91PF 50V NP0 0805 | datasheet.pdf | |
 | RNC55J6040FSRE6 | RES 604 OHM 1/8W 1% AXIAL | datasheet.pdf | |
| B43501A3107M87 | CAP ALUM 100UF 20% 385V SNAP | datasheet.pdf | |
 | 09465000403 | HPP V4 POWER CRIMP CONTACT MALE | datasheet.pdf | |
 | AC244055 | EMULATION EXT PAK PIC16(L)F1939 | datasheet.pdf | |
| PV18-10F-E | CONN SPADE TERM 18-22AWG #10 RED | datasheet.pdf | |
| ATS-03D-147-C3-R0 | HEATSINK 35X35X10MM L-TAB T412 | datasheet.pdf |