Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-MCIMX503EVM8B | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
| Production Status (Lifecycle) | Obsolete / Discontinued | |
| Condition | New & Unused, Original Sealed | |
| PCN Design/Specification | I.MX50 Datasheet Revision 9/Aug/2013 I.MX50 Datasheet Revision 15/Oct/2013 I.MX50 Errata Update 02/Apr/2014 | |
| Standard Package | 270 | |
| Category | Integrated Circuits (ICs) | |
| Family | Embedded - Microprocessors | |
| Series | i.MX50 | |
| Packaging | Tray | |
| Core Processor | ARM® Cortex®-A8 | |
| Number of Cores/Bus Width | 1 Core, 32-Bit | |
| Speed | 800MHz | |
| Co-Processors/DSP | Multimedia; NEON™ SIMD | |
| RAM Controllers | LPDDR, LPDDR2, DDR2 | |
| Graphics Acceleration | Yes | |
| Display & Interface Controllers | LCD | |
| Ethernet | 10/100 Mbps (1) | |
| SATA | - | |
| USB | USB 2.0 + PHY (2) | |
| Voltage - I/O | 1.2V, 1.875V, 2.775V, 3.0V | |
| Operating Temperature | -20°C ~ 70°C | |
| Security Features | Boot Security, Cryptography, Secure JTAG | |
| Package / Case | 400-LFBGA | |
| Supplier Device Package | 400-MAPBGA (17x17) | |
| Additional Interfaces | 1-Wire, AC'97, I²C, I²S, MMC/SD, SPI, SSI, UART | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | MCIMX503EVM8B | |
| Related Links | MCIMX5, MCIMX503EVM8B Datasheet, NXP Semiconductors/Freescale Semiconductor, Inc. Distributor | |
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