Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-MCIMX513DJM8C | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| Featured Product | i.MX51 Applications Processors | |
| EDA / CAD Models | Download from Accelerated Designs | |
| Standard Package | 420 | |
| Category | Integrated Circuits (ICs) | |
| Family | Embedded - Microprocessors | |
| Series | i.MX51 | |
| Packaging | Tray | |
| Core Processor | ARM® Cortex®-A8 | |
| Number of Cores/Bus Width | 1 Core, 32-Bit | |
| Speed | 800MHz | |
| Co-Processors/DSP | Multimedia; NEON™ SIMD | |
| RAM Controllers | LPDDR, DDR2 | |
| Graphics Acceleration | No | |
| Display & Interface Controllers | Keypad, LCD | |
| Ethernet | 10/100 Mbps (1) | |
| SATA | - | |
| USB | USB 2.0 (3), USB 2.0 + PHY (1) | |
| Voltage - I/O | 1.2V, 1.875V, 2.775V, 3.0V | |
| Operating Temperature | -20°C ~ 85°C | |
| Security Features | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC | |
| Package / Case | 529-LFBGA | |
| Supplier Device Package | 529-BGA Case 2017 (19x19) | |
| Additional Interfaces | 1-Wire, AC'97, I²C, I²S, MMC/SD, SPI, SSI, UART | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | MCIMX513DJM8C | |
| Related Links | MCIMX5, MCIMX513DJM8C Datasheet, NXP Semiconductors/Freescale Semiconductor, Inc. Distributor | |
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