Ship from: HONGKONG
								Date Code: Newest Date Code
								Manufacturer lead time 6 weeks
| Internal Part Number | EIS-MCIMX535DVV1CR2 | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| PCN Design/Specification | I.MX53 Errata Update 16/Jul/2013 I.MX53 Maskset/Errata Update 02/Apr/2014 | |
| Standard Package | 750 | |
| Category | Integrated Circuits (ICs) | |
| Family | Embedded - Microprocessors | |
| Series | i.MX53 | |
| Packaging | Tape & Reel (TR) | |
| Core Processor | ARM® Cortex®-A8 | |
| Number of Cores/Bus Width | 1 Core, 32-Bit | |
| Speed | 1.0GHz | |
| Co-Processors/DSP | Multimedia; NEON™ SIMD | |
| RAM Controllers | LPDDR2, DDR2, DDR3 | |
| Graphics Acceleration | Yes | |
| Display & Interface Controllers | Keypad, LCD | |
| Ethernet | 10/100 Mbps (1) | |
| SATA | SATA 1.5Gbps (1) | |
| USB | USB 2.0 (2), USB 2.0 + PHY (2) | |
| Voltage - I/O | 1.3V, 1.8V, 2.775V, 3.3V | |
| Operating Temperature | -20°C ~ 85°C | |
| Security Features | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | |
| Package / Case | 529-FBGA | |
| Supplier Device Package | 529-TEPBGA-2 (19x19) | |
| Additional Interfaces | 1-Wire, AC'97, CAN, I²C, I²S, MMC/SD, SAI, SPI, SSI, UART | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | MCIMX535DVV1CR2 | |
| Related Links | MCIMX53, MCIMX535DVV1CR2 Datasheet, NXP Semiconductors/Freescale Semiconductor, Inc. Distributor | |
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