Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-MCIMX6D5EYM10ACR | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| PCN Design/Specification | I.MX 6Dual/6Quad Errata Update 11/Dec/2013 I.MX6DQ Rev 1.3 Errata Revision 28/Jan/2014 I.MX6 Datasheet Update 01/May/2014 Reference Manual Update 01/Aug/2014 Design Change 01/Aug/2014 Errata Update 01/Jul/2015 Datasheet Correction 16/Nov/2015 | |
| PCN Assembly/Origin | i.MX6Q/D Assembly Site 24/Jan/2014 Assembly Site Addition 05/Mar/2015 Reference Manual Update 28/Jul/2015 | |
| Standard Package | 500 | |
| Category | Integrated Circuits (ICs) | |
| Family | Embedded - Microprocessors | |
| Series | i.MX6D | |
| Packaging | Tape & Reel (TR) | |
| Core Processor | ARM® Cortex®-A9 | |
| Number of Cores/Bus Width | 2 Core, 32-Bit | |
| Speed | 1.0GHz | |
| Co-Processors/DSP | Multimedia; NEON™ SIMD | |
| RAM Controllers | LPDDR2, LVDDR3, DDR3 | |
| Graphics Acceleration | Yes | |
| Display & Interface Controllers | Keypad, LCD | |
| Ethernet | 10/100/1000 Mbps (1) | |
| SATA | SATA 3Gbps (1) | |
| USB | USB 2.0 + PHY (4) | |
| Voltage - I/O | 1.8V, 2.5V, 2.8V, 3.3V | |
| Operating Temperature | -20°C ~ 105°C | |
| Security Features | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | |
| Package / Case | 624-FBGA, FCBGA | |
| Supplier Device Package | 624-FCBGA (21x21) | |
| Additional Interfaces | CAN, I²C, I²S, MMC/SD/SDIO, SAI, SPI, SSI, UART | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | MCIMX6D5EYM10ACR | |
| Related Links | MCIMX6D5, MCIMX6D5EYM10ACR Datasheet, NXP Semiconductors/Freescale Semiconductor, Inc. Distributor | |
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