Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-MCP14E3T-E/SN | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| PCN Design/Specification | SOIC-8L Copper Bond Wire 18/Dec/2013 PdCu Bond Wire Update 21/Sep/2015 | |
| PCN Assembly/Origin | SOIC-8L Copper Bond Wire Revision 06/Feb/2014 Assembly Site Addition 08/Apr/2015 Assembly Site Addition 08/Apr/2015 | |
| PCN Packaging | Reel Design Update 07/May/2015 Label and Packing Changes 23/Sep/2015 | |
| EDA / CAD Models | Download from Accelerated Designs | |
| Standard Package | 3,300 | |
| Category | Integrated Circuits (ICs) | |
| Family | PMIC - Gate Drivers | |
| Series | - | |
| Packaging | Tape & Reel (TR) | |
| Configuration | Low-Side | |
| Input Type | Inverting | |
| Delay Time | 46ns | |
| Current - Peak | 4A | |
| Number of Configurations | 2 | |
| Number of Outputs | 2 | |
| High Side Voltage - Max (Bootstrap) | - | |
| Voltage - Supply | 4.5 V ~ 18 V | |
| Operating Temperature | -40°C ~ 125°C | |
| Mounting Type | Surface Mount | |
| Package / Case | 8-SOIC (0.154", 3.90mm Width) | |
| Supplier Device Package | 8-SOIC N | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | MCP14E3T-E/SN | |
| Related Links | MCP14E, MCP14E3T-E/SN Datasheet, Microchip Technology Distributor | |
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