Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
Internal Part Number | EIS-MCP23009-E/MG | |
Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
Production Status (Lifecycle) | In Production | |
Condition | New & Unused, Original Sealed | |
PCN Design/Specification | Mold Compound Update 31/Oct/2014 Lead Frame Update 16/Feb/2015 | |
PCN Assembly/Origin | Qualification QFN-28,20,16 Packages 26/Dec/2013 Qualification QFN-28,20,16 with Copper 09/Jan/2014 Qualification Report 28/Jan/2014 Qualification Copper Wire Revison 01/Apr/2014 Cancelation of Copper Assembly 25/Jun/2015 | |
PCN Packaging | Label and Packing Changes 23/Sep/2015 | |
PCN Other | MCP23009, MCP23S09 Data Sheet Updates 03/Sep/2014 | |
EDA / CAD Models | Download from Accelerated Designs | |
Standard Package | 120 | |
Category | Integrated Circuits (ICs) | |
Family | Interface - I/O Expanders | |
Series | - | |
Packaging | Tube | |
Number of I/O | 8 | |
Interface | I²C | |
Interrupt Output | Yes | |
Features | POR | |
Output Type | Open Drain | |
Current - Output Source/Sink | 25mA | |
Frequency - Clock | 3.4MHz | |
Voltage - Supply | 1.8 V ~ 5.5 V | |
Operating Temperature | -40°C ~ 125°C | |
Mounting Type | Surface Mount | |
Package / Case | 16-VFQFN Exposed Pad | |
Supplier Device Package | 16-QFN-EP (3x3) | |
Weight | 0.001 KG | |
Application | Email for details | |
Alternative Part (Replacement) | MCP23009-E/MG | |
Related Links | MCP230, MCP23009-E/MG Datasheet, Microchip Technology Distributor |
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