Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
Internal Part Number | EIS-MCP3301-BI/SN | |
Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
Production Status (Lifecycle) | In Production | |
Condition | New & Unused, Original Sealed | |
Reference Design Library | TMPSNS-RTD1: 2, 3, or 4-wire RTD Sensor Interface | |
PCN Design/Specification | SOIC-8L Copper Bond Wire 18/Sep/2013 SOIC-8L Copper Bond Wire 18/Dec/2013 | |
PCN Assembly/Origin | SOIC-8L Copper Bond Wire Revision 06/Feb/2014 Assembly Site Addition 08/Apr/2015 Assembly Site Addition 08/Apr/2015 | |
PCN Packaging | Label and Packing Changes 23/Sep/2015 | |
Standard Package | 100 | |
Category | Integrated Circuits (ICs) | |
Family | Data Acquisition - Analog to Digital Converters (ADC) | |
Series | - | |
Packaging | Tube | |
Number of Bits | 13 | |
Sampling Rate (Per Second) | 100k | |
Number of Inputs | 1 | |
Input Type | Differential | |
Data Interface | SPI | |
Configuration | S/H-ADC | |
Ratio - S/H:ADC | 1:1 | |
Number of A/D Converters | 1 | |
Architecture | SAR | |
Reference Type | External | |
Voltage - Supply, Analog | 5V | |
Voltage - Supply, Digital | 5V | |
Features | - | |
Operating Temperature | -40°C ~ 85°C | |
Package / Case | 8-SOIC (0.154", 3.90mm Width) | |
Supplier Device Package | 8-SOIC N | |
Weight | 0.001 KG | |
Application | Email for details | |
Alternative Part (Replacement) | MCP3301-BI/SN | |
Related Links | MCP330, MCP3301-BI/SN Datasheet, Microchip Technology Distributor |
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