Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
Internal Part Number | EIS-MCP6022-I/SN | |
Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
Production Status (Lifecycle) | In Production | |
Condition | New & Unused, Original Sealed | |
PCN Design/Specification | SOIC-8L Copper Bond Wire 18/Sep/2013 SOIC-8L Copper Bond Wire 18/Dec/2013 Multiple Devices Datasheet Update 18/Aug/2014 CuPdAu Update 29/Jun/2015 | |
PCN Assembly/Origin | SOIC-8L Copper Bond Wire Revision 06/Feb/2014 Assembly Site Addition 08/Apr/2015 Assembly Site Addition 08/Apr/2015 | |
PCN Packaging | Label and Packing Changes 23/Sep/2015 | |
EDA / CAD Models | Download from Accelerated Designs | |
Standard Package | 100 | |
Category | Integrated Circuits (ICs) | |
Family | Linear - Amplifiers - Instrumentation, OP Amps, Buffer Amps | |
Series | - | |
Packaging | Tube | |
Amplifier Type | General Purpose | |
Number of Circuits | 2 | |
Output Type | Rail-to-Rail | |
Slew Rate | 7 V/µs | |
Gain Bandwidth Product | 10MHz | |
-3db Bandwidth | - | |
Current - Input Bias | 1pA | |
Voltage - Input Offset | 500µV | |
Current - Supply | 1mA | |
Current - Output / Channel | 30mA | |
Voltage - Supply, Single/Dual (±) | 2.5 V ~ 5.5 V | |
Operating Temperature | -40°C ~ 85°C | |
Mounting Type | Surface Mount | |
Package / Case | 8-SOIC (0.154", 3.90mm Width) | |
Supplier Device Package | 8-SOIC N | |
Weight | 0.001 KG | |
Application | Email for details | |
Alternative Part (Replacement) | MCP6022-I/SN | |
Related Links | MCP602, MCP6022-I/SN Datasheet, Microchip Technology Distributor |
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