Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-MCP604-I/SL | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| PCN Design/Specification | Copper Bond Wire 09/Mar/2015 Copper Bond Wire 5/Nov/2015 | |
| PCN Assembly/Origin | Qualification Copper Bond Wire 31/Oct/2014 | |
| PCN Packaging | Label and Packing Changes 23/Sep/2015 | |
| EDA / CAD Models | Download from Accelerated Designs | |
| Standard Package | 57 | |
| Category | Integrated Circuits (ICs) | |
| Family | Linear - Amplifiers - Instrumentation, OP Amps, Buffer Amps | |
| Series | - | |
| Packaging | Tube | |
| Amplifier Type | General Purpose | |
| Number of Circuits | 4 | |
| Output Type | Rail-to-Rail | |
| Slew Rate | 2.3 V/µs | |
| Gain Bandwidth Product | 2.8MHz | |
| -3db Bandwidth | - | |
| Current - Input Bias | 1pA | |
| Voltage - Input Offset | 700µV | |
| Current - Supply | 230µA | |
| Current - Output / Channel | 22mA | |
| Voltage - Supply, Single/Dual (±) | 2.7 V ~ 6 V | |
| Operating Temperature | -40°C ~ 85°C | |
| Mounting Type | Surface Mount | |
| Package / Case | 14-SOIC (0.154", 3.90mm Width) | |
| Supplier Device Package | 14-SOIC | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | MCP604-I/SL | |
| Related Links | MCP60, MCP604-I/SL Datasheet, Microchip Technology Distributor | |
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