Ship from: HONGKONG
								Date Code: Newest Date Code
								Manufacturer lead time 6 weeks
| Internal Part Number | EIS-MCP6064-E/ST | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| PCN Design/Specification | Wire Coating Change 07/Jul/2015 | |
| PCN Assembly/Origin | Qualification Copper Wire 17/Mar/2014 Copper Bond Wire Qualification 09/Sep/2014 | |
| PCN Packaging | Label and Packing Changes 23/Sep/2015 | |
| EDA / CAD Models | Download from Accelerated Designs | |
| Standard Package | 96 | |
| Category | Integrated Circuits (ICs) | |
| Family | Linear - Amplifiers - Instrumentation, OP Amps, Buffer Amps | |
| Series | - | |
| Packaging | Tube | |
| Amplifier Type | General Purpose | |
| Number of Circuits | 4 | |
| Output Type | Rail-to-Rail | |
| Slew Rate | 0.25 V/µs | |
| Gain Bandwidth Product | 730kHz | |
| -3db Bandwidth | - | |
| Current - Input Bias | 1pA | |
| Voltage - Input Offset | 150µV | |
| Current - Supply | 60µA | |
| Current - Output / Channel | 27mA | |
| Voltage - Supply, Single/Dual (±) | 1.8 V ~ 6 V | |
| Operating Temperature | -40°C ~ 125°C | |
| Mounting Type | Surface Mount | |
| Package / Case | 14-TSSOP (0.173", 4.40mm Width) | |
| Supplier Device Package | 14-TSSOP | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | MCP6064-E/ST | |
| Related Links | MCP606, MCP6064-E/ST Datasheet, Microchip Technology Distributor | |
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