Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
Internal Part Number | EIS-MCR50JZHF2742 | |
Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
Production Status (Lifecycle) | In Production | |
Condition | New & Unused, Original Sealed | |
Standard Package | 4,000 | |
Category | Resistors | |
Family | Chip Resistor - Surface Mount | |
Series | MCR | |
Packaging | Tape & Reel (TR) | |
Resistance (Ohms) | 27.4k | |
Tolerance | ±1% | |
Power (Watts) | 0.5W, 1/2W | |
Composition | Thick Film | |
Features | - | |
Temperature Coefficient | ±100ppm/°C | |
Operating Temperature | -55°C ~ 155°C | |
Package / Case | 2010 (5025 Metric) | |
Supplier Device Package | 2010 (5025 Metric) | |
Size / Dimension | 0.197" L x 0.098" W (5.00mm x 2.50mm) | |
Height | 0.028" (0.70mm) | |
Number of Terminations | 2 | |
Weight | 0.001 KG | |
Application | Email for details | |
Alternative Part (Replacement) | MCR50JZHF2742 | |
Related Links | MCR50J, MCR50JZHF2742 Datasheet, Rohm Semiconductor Distributor |
![]() | B57421V2471J62 | THERMISTOR NTC 470 OHM 5% 0805 | datasheet.pdf | |
![]() | UP0.4UC-100-R | FIXED IND 10UH 1.1A 160 MOHM SMD | datasheet.pdf | |
![]() | RG3216V-8061-B-T5 | RES SMD 8.06K OHM 0.1% 1/4W 1206 | datasheet.pdf | |
![]() | RCM18DRPH | CONN EDGECARD 36POS DIP .156 SLD | datasheet.pdf | |
![]() | XA3S400-4FGG456I | IC FPGA 264 I/O 456FBGA | datasheet.pdf | |
![]() | RNC60H2322BSRE6 | RES 23.2K OHM 1/4W .1% AXIAL | datasheet.pdf | |
![]() | 0HBF0002ZXCOVER | COVER GREY | datasheet.pdf | |
![]() | 782665 RD001 | HOOK-UP STRND 2AWG RED 1000' | datasheet.pdf | |
![]() | 929648-01-33-I | CONN HEADER 33POS R/A .100" GOLD | datasheet.pdf | |
![]() | 09664137603 | D-Sub Connector Receptacle, Female Sockets 37 Position Through Hole, Right Angle Solder | datasheet.pdf | |
![]() | ND21105000J0G | 350 TB SP PL PCB CONNECT | datasheet.pdf | |
![]() | BFC247022184 | CAP FILM 180NF 5% 100VDC RAD | datasheet.pdf |