Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-MIC2827-B2YMT-TR | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| Featured Product | MIC2827 Triple Output PMIC | |
| PCN Assembly/Origin | Wafer Size Update 02/Sep/2015 | |
| Standard Package | 5,000 | |
| Category | Integrated Circuits (ICs) | |
| Family | PMIC - Power Management - Specialized | |
| Series | - | |
| Packaging | Tape & Reel (TR) | |
| Applications | Processor | |
| Current - Supply | - | |
| Voltage - Supply | 2.7 V ~ 5.5 V | |
| Operating Temperature | -40°C ~ 125°C | |
| Mounting Type | Surface Mount | |
| Package / Case | 14-UFQFN Exposed Pad, 14-TMLF® | |
| Supplier Device Package | 14-TMLF® (2.5x2.5) | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | MIC2827-B2YMT-TR | |
| Related Links | MIC2827-, MIC2827-B2YMT-TR Datasheet, Microchip Technology Distributor | |
![]() | LM74CIBP-3 | SENSOR TEMPERATURE SPI 5DSBGA | datasheet.pdf | |
![]() | 1140-270K | FIXED IND 27UH 21A 10 MOHM TH | datasheet.pdf | |
![]() | RG1608N-2262-B-T1 | RES SMD 22.6KOHM 0.1% 1/10W 0603 | datasheet.pdf | |
![]() | AD5541CRZ-REEL7 | IC DAC 16BIT SRL 8SOIC | datasheet.pdf | |
![]() | 9632.5100 | HEX STANDOFF M3 NYLON 25MM | datasheet.pdf | |
![]() | MPC8377EVRANGA | IC MPU MPC83XX 800MHZ 689TEPBGA | datasheet.pdf | |
![]() | 0011172851 | 60619 15 6061915 | datasheet.pdf | |
![]() | S0603-271NF2C | FIXED IND 270NH 200MA 2.2 OHM | datasheet.pdf | |
![]() | 2403 260 00133 | SPEAKER - SAMBO WATERPROOF | datasheet.pdf | |
![]() | ATS-18F-20-C3-R0 | HEATSINK 54X54X25MM XCUT T412 | datasheet.pdf | |
![]() | ATS-10B-189-C2-R0 | HEATSINK 45X45X20MM R-TAB T766 | datasheet.pdf | |
![]() | ATS-10E-113-C3-R0 | HEATSINK 40X40X10MM XCUT T412 | datasheet.pdf |