Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-MIC38300HYHL-TR | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 2 (1 Year) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| Mfg Application Notes | How to Power GSM/GPRS/EDGE/3G/HSPA M2M Modems | |
| PCN Assembly/Origin | Wafer Size Update 02/Sep/2015 | |
| Standard Package | 1,000 | |
| Category | Power Supplies - Board Mount | |
| Family | DC DC Converters | |
| Series | HELDO™ | |
| Packaging | Tape & Reel (TR) | |
| Type | Non-Isolated PoL Module | |
| Number of Outputs | 1 | |
| Voltage - Input (Min) | 3V | |
| Voltage - Input (Max) | 5.5V | |
| Voltage - Output 1 | 1 ~ 5 V | |
| Voltage - Output 2 | - | |
| Voltage - Output 3 | - | |
| Current - Output (Max) | 3A | |
| Power (Watts) - Manufacture Series | - | |
| Voltage - Isolation | - | |
| Features | OCP, OVP, UVLO | |
| Mounting Type | Surface Mount | |
| Package / Case | 28-PowerVQFN Variant, 28-MLF® | |
| Size / Dimension | 0.236" L x 0.158" W (6.00mm x 4.00mm) | |
| Operating Temperature | -40°C ~ 125°C | |
| Efficiency | - | |
| Power (Watts) - Max | - | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | MIC38300HYHL-TR | |
| Related Links | MIC3830, MIC38300HYHL-TR Datasheet, Microchip Technology Distributor | |
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