Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-MKT1818447064G | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| Mfg Application Notes | Soldering Guidelines Appl Note | |
| Standard Package | 1,000 | |
| Category | Capacitors | |
| Family | Film Capacitors | |
| Series | MKT1818 | |
| Packaging | * | |
| Capacitance | 0.47µF | |
| Tolerance | ±5% | |
| Voltage Rating - AC | 40V | |
| Voltage Rating - DC | 63V | |
| Dielectric Material | Polyester, Metallized | |
| ESR (Equivalent Series Resistance) | - | |
| Operating Temperature | -55°C ~ 105°C | |
| Mounting Type | * | |
| Package / Case | * | |
| Size / Dimension | * | |
| Height - Seated (Max) | * | |
| Termination | * | |
| Lead Spacing | * | |
| Applications | General Purpose | |
| Features | - | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | MKT1818447064G | |
| Related Links | MKT1818, MKT1818447064G Datasheet, Vishay/BCcomponents Distributor | |
![]() | 1130-3R9M | FIXED IND 3.9UH 21A 3 MOHM TH | datasheet.pdf | |
![]() | DS1236-10+ | IC MICRO MANAGER 10% 16-DIP | datasheet.pdf | |
![]() | CY7C1361C-133AXCT | IC SRAM 9MBIT 133MHZ 100TQFP | datasheet.pdf | |
![]() | EBA28DTBI | CONN EDGECARD 56POS R/A .125 SLD | datasheet.pdf | |
![]() | 57102-G08-24LF | MINITEK | datasheet.pdf | |
![]() | BAS116LT3G | DIODE GEN PURP 75V 200MA SOT23-3 | datasheet.pdf | |
![]() | 0191890002 | BUTT SPLICE KRIMPTITE (A-145) | datasheet.pdf | |
![]() | CMF602R5500FLBF | RES 2.55 OHM 1W 1% AXIAL | datasheet.pdf | |
![]() | 310-83-113-41-105191 | Connector Socket 13 Position 0.100" (2.54mm) Gold Surface Mount | datasheet.pdf | |
![]() | ABC28DRMN-S328 | CONN EDGECARD 56POS .100" | datasheet.pdf | |
![]() | 42-11227 | CONN M8 FML 8POS | datasheet.pdf | |
![]() | EP7312-IV-C | HIGH-PERFORMANCE, LOW-POWER SYSTEM-ON-CHIP WITH SDRAM AND ENHANCED DIGITAL AUDIO INTERFACE IC | datasheet.pdf |