Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
Internal Part Number | EIS-MPC850DECZQ50BU | |
Lead Free Status / RoHS Status | Contains lead / RoHS non-compliant | |
Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
Production Status (Lifecycle) | In Production | |
Condition | New & Unused, Original Sealed | |
PCN Design/Specification | Copper Wire Bond Update 01/Aug/2014 | |
Standard Package | 120 | |
Category | Integrated Circuits (ICs) | |
Family | Embedded - Microprocessors | |
Series | MPC8xx | |
Packaging | Tray | |
Core Processor | MPC8xx | |
Number of Cores/Bus Width | 1 Core, 32-Bit | |
Speed | 50MHz | |
Co-Processors/DSP | Communications; CPM | |
RAM Controllers | DRAM | |
Graphics Acceleration | No | |
Display & Interface Controllers | - | |
Ethernet | 10 Mbps (1) | |
SATA | - | |
USB | USB 1.x (1) | |
Voltage - I/O | 3.3V | |
Operating Temperature | -40°C ~ 95°C | |
Security Features | - | |
Package / Case | 256-BBGA | |
Supplier Device Package | 256-PBGA (23x23) | |
Additional Interfaces | HDLC/SDLC, I²C, IrDA, PCMCIA-ATA, TDM, UART/USART | |
Weight | 0.001 KG | |
Application | Email for details | |
Alternative Part (Replacement) | MPC850DECZQ50BU | |
Related Links | MPC850D, MPC850DECZQ50BU Datasheet, NXP Semiconductors/Freescale Semiconductor, Inc. Distributor |
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