Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-MPC8560ADS-BGA | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Production Status (Lifecycle) | Obsolete / Discontinued | |
| Condition | New & Unused, Original Sealed | |
| Design Resources | Development Tool Selector | |
| Standard Package | 1 | |
| Category | Programmers, Development Systems | |
| Family | Evaluation Boards - Embedded - MCU, DSP | |
| Series | PowerQUICC III™ | |
| Board Type | Evaluation Platform | |
| Type | MPU | |
| Core Processor | e500 | |
| Operating System | - | |
| Platform | - | |
| For Use With/Related Products | MPC8560 | |
| Mounting Type | Fixed | |
| Contents | Board(s) | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | MPC8560ADS-BGA | |
| Related Links | MPC8560, MPC8560ADS-BGA Datasheet, NXP Semiconductors/Freescale Semiconductor, Inc. Distributor | |
![]() | RG1608N-1782-W-T1 | RES SMD 17.8K OHM 1/10W 0603 | datasheet.pdf | |
![]() | ISL6522CR-T | IC REG CTRLR BUCK PWM 16-QFN | datasheet.pdf | |
![]() | MNR14E0APJ132 | RES ARRAY 4 RES 1.3K OHM 1206 | datasheet.pdf | |
![]() | RG1005P-2100-W-T1 | RES SMD 210 OHM 0.05% 1/16W 0402 | datasheet.pdf | |
![]() | BF421-AP | TRANS PNP 300V 0.5A TO-92 | datasheet.pdf | |
![]() | P51-200-A-U-P-4.5OVP-000-000 | SENSOR 200PSI 7/16-20-2B .5-4.5V | datasheet.pdf | |
| LLS1J332MELZ | CAP ALUM 3300UF 20% 63V SNAP | datasheet.pdf | ||
![]() | LFXP2-8E-5TN144I | IC FPGA 100 I/O 144TQFP | datasheet.pdf | |
![]() | 1-5-5498 | TAPE PTFE EXTRUDED FILM 1" X 5YD | datasheet.pdf | |
![]() | MS3101F20-27PW | CONN RCPT 14POS INLINE W/PINS | datasheet.pdf | |
![]() | 342-10-158-00-591000 | CONN HEADER 58POS .100 L.210 | datasheet.pdf | |
![]() | 3191013 | CONN TERM BLOCK | datasheet.pdf |