Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-MPC860ENCZQ66D4 | |
| Lead Free Status / RoHS Status | Contains lead / RoHS non-compliant | |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| PCN Design/Specification | Copper Wire Bond Update 01/Aug/2014 | |
| Standard Package | 88 | |
| Category | Integrated Circuits (ICs) | |
| Family | Embedded - Microprocessors | |
| Series | MPC8xx | |
| Packaging | Tray | |
| Core Processor | MPC8xx | |
| Number of Cores/Bus Width | 1 Core, 32-Bit | |
| Speed | 66MHz | |
| Co-Processors/DSP | Communications; CPM | |
| RAM Controllers | DRAM | |
| Graphics Acceleration | No | |
| Display & Interface Controllers | - | |
| Ethernet | 10 Mbps (4) | |
| SATA | - | |
| USB | - | |
| Voltage - I/O | 3.3V | |
| Operating Temperature | -40°C ~ 95°C | |
| Security Features | - | |
| Package / Case | 357-BBGA | |
| Supplier Device Package | 357-PBGA (25x25) | |
| Additional Interfaces | I²C, IrDA, PCMCIA, SPI, TDM, UART/USART | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | MPC860ENCZQ66D4 | |
| Related Links | MPC860E, MPC860ENCZQ66D4 Datasheet, NXP Semiconductors/Freescale Semiconductor, Inc. Distributor | |
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