NXP Semiconductors/Freescale Semiconductor, Inc. MPC860ENCZQ66D4
- Mfg. Part Number
- MPC860ENCZQ66D4
- Manufacturer
- NXP Semiconductors/Freescale Semiconductor, Inc.
- Product Category
- Embedded - Microprocessors
- Brief Description
- IC MPU MPC8XX 66MHZ 357BGA
- Datasheet Download
- MPC860ENCZQ66D4.pdf
Availability of MPC860ENCZQ66D4
Available Quantity
5020 Pieces
Can ship today
Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
- Marketing Price
- $ 72.45591
- Our Price
- Quote by Email
EIS Components is the stocking Distributor of MPC860ENCZQ66D4, we specialize in NXP Semiconductors/Freescale Semiconductor, Inc. all series electronic components. MPC860ENCZQ66D4 can be shipped within 24 hours after order. If you have any demands for MPC860ENCZQ66D4, Please kindly submit an RFQ here or send us an email. We will reply you as soon as possible.
- MPC860ENCZQ66D4 Order Process
- Add Parts to RFQ form
- Submit RFQ
- We reply within 24 hours
- You confirm order
- Payment
- Ship out your order
Specifications of
MPC860ENCZQ66D4
| Internal Part Number | EIS-MPC860ENCZQ66D4 | |
| Lead Free Status / RoHS Status | Contains lead / RoHS non-compliant | |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| PCN Design/Specification | Copper Wire Bond Update 01/Aug/2014 | |
| Standard Package | 88 | |
| Category | Integrated Circuits (ICs) | |
| Family | Embedded - Microprocessors | |
| Series | MPC8xx | |
| Packaging | Tray | |
| Core Processor | MPC8xx | |
| Number of Cores/Bus Width | 1 Core, 32-Bit | |
| Speed | 66MHz | |
| Co-Processors/DSP | Communications; CPM | |
| RAM Controllers | DRAM | |
| Graphics Acceleration | No | |
| Display & Interface Controllers | - | |
| Ethernet | 10 Mbps (4) | |
| SATA | - | |
| USB | - | |
| Voltage - I/O | 3.3V | |
| Operating Temperature | -40°C ~ 95°C | |
| Security Features | - | |
| Package / Case | 357-BBGA | |
| Supplier Device Package | 357-PBGA (25x25) | |
| Additional Interfaces | I²C, IrDA, PCMCIA, SPI, TDM, UART/USART | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | MPC860ENCZQ66D4 | |
| Related Links | MPC860E, MPC860ENCZQ66D4 Datasheet, NXP Semiconductors/Freescale Semiconductor, Inc. Distributor | |
MPC860ENCZQ66D4 Details Description
Related parts for MPC860ENCZQ66D4
 | 624-25ABT4 | HEATSINK CPU 21MM SQ W/DBL TAPE | datasheet.pdf | |
 | IRKL71/16A | SCR DBL HISCR 1600V 75A ADDAPAK | datasheet.pdf | |
 | 0907-1-15-20-75-14-11-0 | CONN PIN SPRING-LOAD .275 20GOLD | datasheet.pdf | |
| 5680123232F | LED CBI 4X1 RECT YLW,GRN,YLW,GRN | datasheet.pdf | |
 | V375B28C300BL3 | CONVERTER MOD DC/DC 28V 300W | datasheet.pdf | |
 | CDR31BP3R6BCZSAT | CAP CER 3.6PF 100V BP 0805 | datasheet.pdf | |
 | RN55D4R75FB14 | RES 4.75 OHM 1/8W 1% AXIAL | datasheet.pdf | |
| UCOM-10G+ PTSGB | CONN PLUG 8POS INLINE PIN | datasheet.pdf | |
 | CP2104-MINIEK | KIT EVAL FOR CP2104-MINI | datasheet.pdf | |
| ATS-02G-209-C2-R0 | HEATSINK 70X70X10MM XCUT T766 | datasheet.pdf | |
| CES-4-D3 | HEAT SHRINK TUBING | datasheet.pdf | |
 | SIT9002AC-43H25DQ | OSC MEMS PROG | datasheet.pdf |