Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-MR25H10MDF | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| Standard Package | 570 | |
| Category | Integrated Circuits (ICs) | |
| Family | Memory | |
| Series | Automotive, AEC-Q100 | |
| Packaging | Tray | |
| Format - Memory | RAM | |
| Memory Type | MRAM (Magnetoresistive RAM) | |
| Memory Size | 1M (128K x 8) | |
| Speed | 40MHz | |
| Interface | SPI Serial | |
| Voltage - Supply | 2.7 V ~ 3.6 V | |
| Operating Temperature | -40°C ~ 125°C | |
| Package / Case | 8-VDFN Exposed Pad | |
| Supplier Device Package | 8-DFN-EP, Small Flag (5x6) | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | MR25H10MDF | |
| Related Links | MR25H, MR25H10MDF Datasheet, Everspin Technologies Inc. Distributor | |
![]() | LM2575D2T-5R4 | IC REG MULT CONFIG INV 5V D2PAK | datasheet.pdf | |
![]() | VJ0402A1R0CNAAJ | CAP CER 1PF 50V NP0 0402 | datasheet.pdf | |
![]() | 1879683-7 | RES 124 OHM 1/4W 0.1% AXIAL | datasheet.pdf | |
![]() | 84S-AC2-113-N | KEYPAD 12 BTN 3X4 SEALED | datasheet.pdf | |
![]() | CSC08A03330RGEK | RES ARRAY 4 RES 330 OHM 8SIP | datasheet.pdf | |
![]() | RN55E39R2BB14 | RES 39.2 OHM 1/8W .1% AXIAL | datasheet.pdf | |
| TCT3-11E07AE | XFRMR LAMINATED 2.5VA CHAS MOUNT | datasheet.pdf | ||
![]() | 82663-1056 | STD UMQ SAFETY MAT 48"X72" | datasheet.pdf | |
![]() | 150-10-650-00-006101 | DIL SURFACE MOUNT 2.54MM | datasheet.pdf | |
![]() | 510-83-088-12-051101 | CONN SOCKET PGA 88POS GOLD | datasheet.pdf | |
![]() | ATS-20A-185-C2-R0 | HEATSINK 40X40X30MM R-TAB T766 | datasheet.pdf | |
![]() | D38999/20WC8JD-LC | CONN HSG RCPT FLANGE 8POS SKT | datasheet.pdf |