Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-MR4A08BCYS35 | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| PCN Design/Specification | Mold Compound Update 15/Dec/2014 | |
| Standard Package | 135 | |
| Category | Integrated Circuits (ICs) | |
| Family | Memory | |
| Series | - | |
| Packaging | Tray | |
| Format - Memory | RAM | |
| Memory Type | MRAM (Magnetoresistive RAM) | |
| Memory Size | 16M (2M x 8) | |
| Speed | 35ns | |
| Interface | Parallel | |
| Voltage - Supply | 3 V ~ 3.6 V | |
| Operating Temperature | -40°C ~ 85°C | |
| Package / Case | 44-TSOP (0.400", 10.16mm Width) | |
| Supplier Device Package | 44-TSOP2 (10.2x18.4) | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | MR4A08BCYS35 | |
| Related Links | MR4A08, MR4A08BCYS35 Datasheet, Everspin Technologies Inc. Distributor | |
![]() | XCS20XL-5PQ208C | IC FPGA 160 I/O 208PQFP | datasheet.pdf | |
![]() | HCC65DRYN-S734 | CONN EDGECARD 130PS DIP .100 SLD | datasheet.pdf | |
![]() | GCM22DRAI | CONN EDGECARD 44POS R/A .156 SLD | datasheet.pdf | |
![]() | 06035J0R4BAWTR | CAP THIN FILM 0.4PF 50V 0603 | datasheet.pdf | |
![]() | MAX4374TESD+ | IC AMP CURRENT SENSE 14-SOIC | datasheet.pdf | |
![]() | LP6OA2ASRG | SWITCH PUSH DPST-NO 12MA 12V | datasheet.pdf | |
![]() | 6-6435029-1 | CA,50,24F,OFNP,MPO | datasheet.pdf | |
| 675714-000 | SOLDER SLEEVE .170" DIA IMM RES | datasheet.pdf | ||
![]() | 882-70-056-20-001101 | CONN HDR 56POS 2MM T/H R/A | datasheet.pdf | |
![]() | ATS-16C-64-C1-R0 | HEATSINK 40X40X25MM L-TAB | datasheet.pdf | |
![]() | ATS-12E-101-C3-R0 | HEATSINK 45X45X30MM R-TAB T412 | datasheet.pdf | |
![]() | SST26WF016BAT-104I/MF | IC FLASH 16MBIT | datasheet.pdf |