Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-MS27467E9B35P-LC | |
| Lead Free Status / RoHS Status | Contains lead / RoHS non-compliant | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| Standard Package | 1 | |
| Category | Connectors, Interconnects | |
| Family | Circular Connectors - Housings | |
| Series | * | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | MS27467E9B35P-LC | |
| Related Links | MS27467E, MS27467E9B35P-LC Datasheet, Amphenol Aerospace Operations Distributor | |
![]() | EGL34D/1 | DIODE GEN PURP 200V 500MA DO213 | datasheet.pdf | |
![]() | 4-640428-3 | CONN RECEPT 13POS 22AWG MTA156 | datasheet.pdf | |
![]() | BCS-116-L-S-TE | CONN RCPT 16POS .100" SNGL VERT | datasheet.pdf | |
![]() | MA-505 22.4000M-C:ROHS | Crystal 22.4000MHz 50ppm 18pF 40 Ohm -20°C - 70°C Surface Mount 2-SOJ, 2.60mm pitch | datasheet.pdf | |
![]() | ASBM21Y | TERM BLOCK 3CONT DIN 5MM YELLOW | datasheet.pdf | |
![]() | 4816P-2-511 | RES ARRAY 15 RES 510 OHM 16SOIC | datasheet.pdf | |
![]() | .5MIC 3M662XW DLF 3MIL TH 4.25 IN | LAPPING FILM DIAMOND 4.25" DIA | datasheet.pdf | |
![]() | RN60C2671FBSL | RES 2.67K OHM 1/4W 1% AXIAL | datasheet.pdf | |
![]() | 02982028LXFC-F100 | FUSE BLOK BLT DWN 32V 500A CHASS | datasheet.pdf | |
![]() | 803-87-038-10-268101 | Connector Socket 38 Position 0.100" (2.54mm) Gold Through Hole | datasheet.pdf | |
![]() | 0387090339 | Connector Barrier Block Strip 6 Circuit 0.325" (8.26mm) | datasheet.pdf | |
![]() | 55100-3H-03-A | SENSOR HALL EFFECT | datasheet.pdf |