Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-MS27467T17B35S-BOM | |
| Lead Free Status / RoHS Status | Contains lead / RoHS non-compliant | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| Standard Package | 1 | |
| Category | Connectors, Interconnects | |
| Family | Circular Connectors | |
| Series | * | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | MS27467T17B35S-BOM | |
| Related Links | MS27467T1, MS27467T17B35S-BOM Datasheet, Amphenol Aerospace Operations Distributor | |
![]() | LTC1147CS8-3.3#TR | IC REG CTRLR BUCK PWM CM 8-SOIC | datasheet.pdf | |
![]() | ESA10DTAD | CONN EDGECARD 20POS R/A .125 SLD | datasheet.pdf | |
![]() | RGC1206FTD3M01 | RES SMD 3.01M OHM 1% 1/4W 1206 | datasheet.pdf | |
![]() | SI1972DH-T1-GE3 | MOSFET 2N-CH 30V 1.3A SC-70-6 | datasheet.pdf | |
![]() | V110C3V3C50BG2 | CONVERTER MOD DC/DC 3.3V 50W | datasheet.pdf | |
![]() | 4695PA51H01275 | GK NICU PTAFG PU V0 SQ | datasheet.pdf | |
![]() | ATS-17H-138-C3-R0 | HEATSINK 25X25X15MM L-TAB T412 | datasheet.pdf | |
![]() | SIT9102AI-433N33E100.00000 (BULK) | OSC MEMS 100.000MHZ HCSL SMD | datasheet.pdf | |
![]() | VJ0805D3R3BXXAJ | CAP CER 3.3PF 25V NP0 0805 | datasheet.pdf | |
![]() | 87629113 | COUNTER | datasheet.pdf | |
![]() | ER12-200J3PB | ENC DISC200J NEMA12 BLK | datasheet.pdf | |
![]() | AD8155 | 6.5 Gbps Dual Buffer Mux/Demux IC | datasheet.pdf |