Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
Internal Part Number | EIS-MS27505E13B4PB | |
Lead Free Status / RoHS Status | Contains lead / RoHS non-compliant | |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
Production Status (Lifecycle) | In Production | |
Condition | New & Unused, Original Sealed | |
Standard Package | 1 | |
Category | Connectors, Interconnects | |
Family | Circular Connectors | |
Series | * | |
Weight | 0.001 KG | |
Application | Email for details | |
Alternative Part (Replacement) | MS27505E13B4PB | |
Related Links | MS27505, MS27505E13B4PB Datasheet, Amphenol Aerospace Operations Distributor |
![]() | TC7W34FKTE85LF | IC BUFFER TRIPLE NON-INV US8 | datasheet.pdf | |
![]() | ACM15DRUN | CONN EDGECARD 30POS .156 DIP SLD | datasheet.pdf | |
![]() | CRBV55BE-1650-2150 | VCO 1650-2150 MHZ REDBOX | datasheet.pdf | |
![]() | C1812C332G2GACTU | CAP CER 3300PF 200V NP0 1812 | datasheet.pdf | |
![]() | 0387045105 | Connector Barrier Block Strip 5 Circuit 0.325" (8.26mm) | datasheet.pdf | |
![]() | GB8SM | MOUNT MAGN 3/4" 58A SMAM | datasheet.pdf | |
![]() | CMF601K4300FKBF | RES 1.43K OHM 1W 1% AXIAL | datasheet.pdf | |
![]() | ACC25DTMI-S189 | CONN EDGECARD 50POS .100" | datasheet.pdf | |
![]() | 1-1423154-3 | COMMERCIAL 2100 | datasheet.pdf | |
![]() | ACS02E22-11S-003 | AC 2C 2#16 SKT RECP | datasheet.pdf | |
![]() | XCZU2CG-L1SFVC784I | Microprocessor Circuit, CMOS, PBGA784 IC | datasheet.pdf | |
![]() | XCS5210-6PQ208 | XILINX IC XCS5210-6PQ208 Available | datasheet.pdf |