Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-MS27513E8F35P-LC | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| Standard Package | 1 | |
| Category | Connectors, Interconnects | |
| Family | Circular Connectors - Housings | |
| Series | * | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | MS27513E8F35P-LC | |
| Related Links | MS27513E, MS27513E8F35P-LC Datasheet, Amphenol Aerospace Operations Distributor | |
![]() | BA17820FP-E2 | IC REG LDO 20V 1A TO252-3 | datasheet.pdf | |
![]() | 1808SA330MAT1A | CAP CER 33PF 1.5KV NP0 1808 | datasheet.pdf | |
![]() | SDACA-016G-000000 | SSD 16GB 2.5" UATA | datasheet.pdf | |
![]() | SN74AS823ADWR | IC D-TYPE POS TRG SNGL 24SOIC | datasheet.pdf | |
![]() | V24C5T50BG3 | CONVERTER MOD DC/DC 5V 50W | datasheet.pdf | |
![]() | TMB8UP | MOUNT TRUCK RG58U 17' UHFM | datasheet.pdf | |
![]() | 5SGXEA4H2F35I2LN | IC FPGA 552 I/O 1152FBGA | datasheet.pdf | |
![]() | 54111-111112100LF | HEADER BERGSTIK STR | datasheet.pdf | |
![]() | WL1835MODGBMOCT | MODULE WIFI WILINK | datasheet.pdf | |
![]() | ATS-13A-194-C3-R0 | HEATSINK 40X40X10MM XCUT T412 | datasheet.pdf | |
![]() | 55140-2L-04-D | SENSOR HALL EFFECT | datasheet.pdf | |
![]() | 2205076-1 | CABLE ASSEMBLY HEADER WTW 20POS | datasheet.pdf |