Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-MT29C1G12MAAJAFAMD-6 IT | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
| Production Status (Lifecycle) | Obsolete / Discontinued | |
| Condition | New & Unused, Original Sealed | |
| Standard Package | 1,000 | |
| Category | Integrated Circuits (ICs) | |
| Family | Memory | |
| Series | - | |
| Packaging | Bulk | |
| Format - Memory | Multi-Chip (FLASH/RAM) | |
| Memory Type | FLASH - NAND, Mobile LPDRAM | |
| Memory Size | 1G (128M x 8)(NAND), 512M (16M x 32)(LPDRAM) | |
| Speed | 166MHz | |
| Interface | Parallel | |
| Voltage - Supply | 1.7 V ~ 1.95 V | |
| Operating Temperature | -40°C ~ 85°C | |
| Package / Case | 130-VFBGA | |
| Supplier Device Package | 130-VFBGA (8x9) | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | MT29C1G12MAAJAFAMD-6 IT | |
| Related Links | MT29C1G12MA, MT29C1G12MAAJAFAMD-6 IT Datasheet, Micron Technology Distributor | |
![]() | ATH010A0X3-SRZ | CONVE DC/DC 0.75 3.63V @ 10A SMD | datasheet.pdf | |
![]() | MCF5249CVF140 | IC MCU 32BIT ROMLESS 160MAPBGA | datasheet.pdf | |
![]() | 1808AA331KATME | CAP CER 330PF 1KV NP0 1808 | datasheet.pdf | |
| 501798-3 | CONN ADAPTER RCPT FSD-ST DUPLEX | datasheet.pdf | ||
![]() | 3001 00240043 | THERMOSTAT 3001 SER NON-HERMETIC | datasheet.pdf | |
![]() | RLR07C22R0GRB14 | RES 22 OHM 2% 1/4W AXIAL | datasheet.pdf | |
![]() | 343P100 | TRIMMER 100 OHM 0.75W TH | datasheet.pdf | |
![]() | 1736270000 | SEALING RING GWDR M40-NP | datasheet.pdf | |
![]() | AMC12DTAD-S189 | CONN EDGECARD 24POS .100" | datasheet.pdf | |
![]() | ATS-18B-116-C1-R0 | HEATSINK 40X40X25MM XCUT | datasheet.pdf | |
![]() | 1407662 | CONN BASE BOTTOM ENTRY SZB24 | datasheet.pdf | |
![]() | 642021 | POSITIONER | datasheet.pdf |