Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-MT29F128G08AUCBBH3-12IT:B | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
| Production Status (Lifecycle) | Obsolete / Discontinued | |
| Condition | New & Unused, Original Sealed | |
| PCN Obsolescence/ EOL | Multiple Devices 27/Apr/2011 | |
| PCN Assembly/Origin | Fab Site Transistion 19/Nov/2013 | |
| Standard Package | 1,000 | |
| Category | Integrated Circuits (ICs) | |
| Family | Memory | |
| Series | - | |
| Packaging | Bulk | |
| Format - Memory | FLASH | |
| Memory Type | FLASH - NAND | |
| Memory Size | 128G (16G x 8) | |
| Speed | - | |
| Interface | Parallel | |
| Voltage - Supply | 2.7 V ~ 3.6 V | |
| Operating Temperature | -40°C ~ 85°C | |
| Package / Case | 100-LBGA | |
| Supplier Device Package | 100-LBGA (12x18) | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | MT29F128G08AUCBBH3-12IT:B | |
| Related Links | MT29F128G08A, MT29F128G08AUCBBH3-12IT:B Datasheet, Micron Technology Distributor | |
![]() | ERA-V33J122V | RES TEMP SENS 1.2K OHM 5% 1/16W | datasheet.pdf | |
![]() | RT0402DRE0722R1L | RES SMD 22.1 OHM 0.5% 1/16W 0402 | datasheet.pdf | |
![]() | GCM10DTMD | CONN EDGECARD 20POS R/A .156 SLD | datasheet.pdf | |
![]() | EBM08DTMI-S189 | CONN EDGECARD 16POS R/A .156 SLD | datasheet.pdf | |
![]() | KTR18EZPJ180 | RES SMD 18 OHM 5% 1/4W 1206 | datasheet.pdf | |
![]() | 2228-2X3FT* | RUBBER MASTIC TAPE 2" X 3' | datasheet.pdf | |
![]() | ISO723X724XEVM | EVAL MODULE FOR ISO723X724X | datasheet.pdf | |
![]() | DL66R10-05S7-6116-LC | CONN HSG PLUG STRGHT 5POS SKT | datasheet.pdf | |
![]() | KHC500E226M76R0T00 | CAP CER 22UF 50V Y5U 3025 | datasheet.pdf | |
![]() | T020160 | TINKERKIT 4 PIN WIRES 25CM | datasheet.pdf | |
![]() | 030-51304-002 | CONN CONTACT | datasheet.pdf | |
![]() | XC2V3000-5FF896C | Analog Circuit IC | datasheet.pdf |