Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-MT29F16G08ABCBBH1-12:B | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
| Production Status (Lifecycle) | Obsolete / Discontinued | |
| Condition | New & Unused, Original Sealed | |
| PCN Obsolescence/ EOL | Multiple Devices 27/Apr/2011 | |
| PCN Assembly/Origin | Fab Site Transistion 19/Nov/2013 | |
| Standard Package | 1,000 | |
| Category | Integrated Circuits (ICs) | |
| Family | Memory | |
| Series | - | |
| Packaging | Bulk | |
| Format - Memory | FLASH | |
| Memory Type | FLASH - NAND | |
| Memory Size | 16G (2G x 8) | |
| Speed | - | |
| Interface | Parallel | |
| Voltage - Supply | 2.7 V ~ 3.6 V | |
| Operating Temperature | 0°C ~ 70°C | |
| Package / Case | 100-VBGA | |
| Supplier Device Package | 100-VBGA (12x18) | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | MT29F16G08ABCBBH1-12:B | |
| Related Links | MT29F16G08A, MT29F16G08ABCBBH1-12:B Datasheet, Micron Technology Distributor | |
![]() | LTST-C171KEKT | LED RED CLEAR 0805 SMD | datasheet.pdf | |
![]() | GCA10DTAS | CONN EDGECARD 20POS R/A .125 SLD | datasheet.pdf | |
![]() | HBM28DRKF | CONN EDGECARD 56POS DIP .156 SLD | datasheet.pdf | |
![]() | GBB100DHLT | CONN EDGECARD 200PS .050 DIP SLD | datasheet.pdf | |
![]() | LP38511TJ-1.8/NOPB | IC REG LDO 1.8V 0.8A 5PFM | datasheet.pdf | |
![]() | RNC60H2003BSB14 | RES 200K OHM 1/4W .1% AXIAL | datasheet.pdf | |
![]() | 4610X-AP1-102LF | RES ARRAY 9 RES 1K OHM 10SIP | datasheet.pdf | |
![]() | 132-00010 | BUTTON HEAD TIE 105LB 9.6"L BLK | datasheet.pdf | |
![]() | 1719109 | TERM BLOCK | datasheet.pdf | |
![]() | 45129 BK001 | XG4 22AWG 7/30 9PR BRD 300V | datasheet.pdf | |
![]() | HY7 | EARMUFF REPLACE HYGIENE KIT 20PC | datasheet.pdf | |
![]() | ANCG11G57SNM012RD1 | Capacitors Inductors Filters... | datasheet.pdf |