Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-MT29F1G16ABBDAHC:D | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
| Production Status (Lifecycle) | Obsolete / Discontinued | |
| Condition | New & Unused, Original Sealed | |
| PCN Obsolescence/ EOL | NAND Flash Devices 22/Oct/2013 | |
| PCN Assembly/Origin | Fab Site Transistion 19/Nov/2013 | |
| Standard Package | 1,000 | |
| Category | Integrated Circuits (ICs) | |
| Family | Memory | |
| Series | - | |
| Packaging | Bulk | |
| Format - Memory | FLASH | |
| Memory Type | FLASH - NAND | |
| Memory Size | 1G (64M x 16) | |
| Speed | - | |
| Interface | Parallel | |
| Voltage - Supply | 1.7 V ~ 1.95 V | |
| Operating Temperature | 0°C ~ 70°C | |
| Package / Case | 63-VFBGA | |
| Supplier Device Package | 63-VFBGA (10.5x13) | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | MT29F1G16ABBDAHC:D | |
| Related Links | MT29F1G16, MT29F1G16ABBDAHC:D Datasheet, Micron Technology Distributor | |
![]() | 1-534978-2 | CONN HEADR VERT .100 110POS 30AU | datasheet.pdf | |
![]() | RG3216N-1132-B-T5 | RES SMD 11.3K OHM 0.1% 1/4W 1206 | datasheet.pdf | |
![]() | CRA04S08312R0JTD | RES ARRAY 4 RES 12 OHM 0804 | datasheet.pdf | |
![]() | HBC08DRXI-S734 | CONN EDGECARD 16POS DIP .100 SLD | datasheet.pdf | |
![]() | EYM28DTAN | CONN EDGECARD 56POS R/A .156 SLD | datasheet.pdf | |
![]() | MAX3162ECAI+ | IC TXRX RS232/485/422 28SSOP | datasheet.pdf | |
![]() | VJ1206Y123JBBAT4X | CAP CER 0.012UF 100V X7R 1206 | datasheet.pdf | |
| RSMF2JTR240 | RES METAL OX 2W 0.24 OHM 5% AXL | datasheet.pdf | ||
| UKL2A1R5MDD | CAP ALUM 1.5UF 20% 100V RADIAL | datasheet.pdf | ||
| ELZA250ELL152MK20S | CAP ALUM 1500UF 20% 25V RADIAL | datasheet.pdf | ||
![]() | CPF0402B10RE | RES SMD 10 OHM 0.1% 1/16W 0402 | datasheet.pdf | |
![]() | 38817 | HNDLR ADJ 7CELL 8X11-3/4X2-1/4" | datasheet.pdf |