Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
Internal Part Number | EIS-MT9JSF25672AZ-1G4K1 | |
Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
Production Status (Lifecycle) | In Production | |
Condition | New & Unused, Original Sealed | |
Standard Package | 100 | |
Category | Memory Cards, Modules | |
Family | Memory - Modules | |
Series | - | |
Memory Type | DDR3 SDRAM | |
Memory Size | 2GB | |
Speed | 1333MT/s | |
Package / Case | 240-UDIMM | |
Weight | 0.001 KG | |
Application | Email for details | |
Alternative Part (Replacement) | MT9JSF25672AZ-1G4K1 | |
Related Links | MT9JSF256, MT9JSF25672AZ-1G4K1 Datasheet, Micron Technology Distributor |
MAX306EQI+T | IC MULTIPLEXER 16X1 28PLCC | datasheet.pdf | ||
RMCF0402FT1M21 | RES SMD 1.21M OHM 1% 1/16W 0402 | datasheet.pdf | ||
CRCW04021R60JNEDHP | RES SMD 1.6 OHM 5% 1/8W 0402 | datasheet.pdf | ||
M80-8690422 | CONN HDR 2MM VERT DUAL 4POS | datasheet.pdf | ||
MT48LC8M16A2B4-75 IT:G | IC SDRAM 128MBIT 133MHZ 54VFBGA | datasheet.pdf | ||
10119126-E0J-40DLF | XCEDE HD 2W 3PVH 4COL WK | datasheet.pdf | ||
ATS-04G-163-C2-R0 | HEATSINK 45X45X30MM L-TAB T766 | datasheet.pdf | ||
HM13908000J0G | 750 TB SP CLA DIP SOLDER | datasheet.pdf | ||
MBA02040C5901FCT00 | RES 5.9K OHM 0.4W 1% AXIAL | datasheet.pdf | ||
HKQ0603U3N3B-T | FIXED IND 3.3NH 415MA 280 MOHM | datasheet.pdf | ||
2161850-7 | DIRECT CONNECT | datasheet.pdf | ||
TVP00RL-19-88PB-P3AD | HD 38999 88C 88#23 PIN RECP | datasheet.pdf |