Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-MX68GL1G0FHXFI-11G | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| Mfg Application Notes | MX29GLxxxF Migrating From MX29GLxxxP | |
| Standard Package | 144 | |
| Category | Integrated Circuits (ICs) | |
| Family | Memory | |
| Series | MX68GL | |
| Packaging | Tray | |
| Format - Memory | FLASH | |
| Memory Type | FLASH - NOR | |
| Memory Size | 1G (128M x 8) | |
| Speed | 110ns | |
| Interface | Parallel | |
| Voltage - Supply | 2.7 V ~ 3.6 V | |
| Operating Temperature | -40°C ~ 85°C | |
| Package / Case | 64-LBGA, CSPBGA | |
| Supplier Device Package | 64-LFBGA, CSP (11x13) | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | MX68GL1G0FHXFI-11G | |
| Related Links | MX68GL1G0, MX68GL1G0FHXFI-11G Datasheet, Macronix Distributor | |
![]() | BUZ30A | MOSFET N-CH 200V 21A TO-220AB | datasheet.pdf | |
![]() | RG1005N-4020-W-T5 | RES SMD 402 OHM 0.05% 1/16W 0402 | datasheet.pdf | |
| SI7336ADP-T1-E3 | MOSFET N-CH 30V 30A PPAK SO-8 | datasheet.pdf | ||
![]() | 180-M62-113R001 | D-Sub Connector Plug, Male Pins 62 Position Through Hole Solder | datasheet.pdf | |
![]() | LP2980IM5-4.7/NOPB | IC REG LDO 4.7V 50MA SOT23-5 | datasheet.pdf | |
![]() | 3252X-1-101MLF | TRIMMER 100 OHM 0.75W PC PIN | datasheet.pdf | |
![]() | 1301050062 | 1684 W/SWITCH | datasheet.pdf | |
![]() | 7201K19AW4QE | SWITCH TOGGLE DPDT 5A 120V | datasheet.pdf | |
![]() | 801-83-008-30-002101 | Connector Socket 8 Position 0.100" (2.54mm) Gold Surface Mount | datasheet.pdf | |
![]() | ATS-19G-81-C3-R0 | HEATSINK 30X30X20MM R-TAB T412 | datasheet.pdf | |
![]() | CTVPS00RF-25-35P-LC | CTV 128C 128#22D PIN RECP | datasheet.pdf | |
![]() | D38999/24TJ35PA | TV 128C 128#22D PIN J/N RECP | datasheet.pdf |