Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
Internal Part Number | EIS-N25Q064A13EF840F | |
Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
Production Status (Lifecycle) | In Production | |
Condition | New & Unused, Original Sealed | |
Standard Package | 4,000 | |
Category | Integrated Circuits (ICs) | |
Family | Memory | |
Series | - | |
Packaging | Tape & Reel (TR) | |
Format - Memory | FLASH | |
Memory Type | FLASH - NOR | |
Memory Size | 64M (16Mx4) | |
Speed | 108MHz | |
Interface | SPI Serial | |
Voltage - Supply | 2.7 V ~ 3.6 V | |
Operating Temperature | -40°C ~ 85°C | |
Package / Case | 8-VDFN Exposed Pad | |
Supplier Device Package | 8-VDFPN (MLP8) (8x6) | |
Weight | 0.001 KG | |
Application | Email for details | |
Alternative Part (Replacement) | N25Q064A13EF840F | |
Related Links | N25Q064A, N25Q064A13EF840F Datasheet, Micron Technology Distributor |
![]() | LM3S9B96-IBZ80-C3T | IC MCU 32BIT 256KB FLASH 108BGA | datasheet.pdf | |
![]() | 430205-05-0 | Connector Barrier Block Strip 5 Circuit 0.438" (11.12mm) | datasheet.pdf | |
![]() | RLR20C2001FPBSL | RES 2K OHM 1% 1/2W AXIAL | datasheet.pdf | |
![]() | FDC4XPRCA02H850X | D-Sub Connector Plug, Male Pins 37 Position Through Hole Solder | datasheet.pdf | |
![]() | 219-3-2600-539 | CIRCUIT BREAKER MAG-HYDR LEVER | datasheet.pdf | |
![]() | ATS-20E-15-C1-R0 | HEATSINK 50X50X25MM XCUT | datasheet.pdf | |
![]() | ATS-02H-130-C2-R0 | HEATSINK 60X60X15MM XCUT T766 | datasheet.pdf | |
![]() | ATS-10B-169-C1-R0 | HEATSINK 30X30X10MM R-TAB | datasheet.pdf | |
![]() | ATS-18D-191-C2-R0 | HEATSINK 45X45X30MM R-TAB T766 | datasheet.pdf | |
![]() | 1530099-2 | HD INDL NON-AMP APPLI | datasheet.pdf | |
![]() | MKP385212200JC02R0 | CAP FILM 0.0012UF 5% 2000VDC AXI | datasheet.pdf | |
![]() | XCV200 | Platform Flash In-System Programmable Configuration PROMS IC | datasheet.pdf |