Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-NAND512R3A2DZA6E | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
| Production Status (Lifecycle) | Obsolete / Discontinued | |
| Condition | New & Unused, Original Sealed | |
| Standard Package | 1,260 | |
| Category | Integrated Circuits (ICs) | |
| Family | Memory | |
| Series | - | |
| Packaging | Tray | |
| Format - Memory | FLASH | |
| Memory Type | FLASH - NAND | |
| Memory Size | 512M (64M x 8) | |
| Speed | - | |
| Interface | Parallel | |
| Voltage - Supply | 1.7 V ~ 1.95 V | |
| Operating Temperature | -40°C ~ 85°C | |
| Package / Case | 63-TFBGA | |
| Supplier Device Package | 63-VFBGA (9x11) | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | NAND512R3A2DZA6E | |
| Related Links | NAND512R, NAND512R3A2DZA6E Datasheet, Micron Technology Distributor | |
![]() | FCD120630TP | FUSE BOARD MNT 630MA 50VDC 1206 | datasheet.pdf | |
![]() | GMC50DRXI | CONN EDGECARD 100PS DIP .100 SLD | datasheet.pdf | |
![]() | ABM28DTKI | CONN EDGECARD 56POS DIP .156 SLD | datasheet.pdf | |
![]() | ISL9014AIRJMZ-T | IC REG LDO 2.8V/3V 0.3A 10DFN | datasheet.pdf | |
![]() | 62802-2 | Connector Quick Connect Receptacle 16-22 AWG 0.187" (4.75mm) Crimp | datasheet.pdf | |
![]() | T95R227K016CSAS | CAP TANT 220UF 16V 10% 2824 | datasheet.pdf | |
![]() | RNC55H2870FSR36 | RES 287 OHM 1/8W 1% AXIAL | datasheet.pdf | |
![]() | RWR89S14R0FSBSL | RES 14 OHM 3W 1% WW AXIAL | datasheet.pdf | |
![]() | 7205SY9V3QE | SWITCH TOGGLE DPDT 5A 120V | datasheet.pdf | |
| 1-1971838-4 | 14P,RAST 2.5 TAB HEADER,EX- LOCK | datasheet.pdf | ||
![]() | TX40SJ00-0808 | CONN BACKSHELL ADPT SZ 9A M12 | datasheet.pdf | |
![]() | BACC63BP22H19S7H | 26500 19C 19#16 S PLUG AN LC | datasheet.pdf |