Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-NXN1.75GN | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| Standard Package | 1 | |
| Category | Cables, Wires - Management | |
| Family | Spiral Wrap, Expandable Sleeving | |
| Series | Flexo® | |
| Type | Expandable Sleeving | |
| Diameter | 1.750" (44.50mm) | |
| Diameter - Maximum | 2.000" (50.80mm) | |
| Length | 100' (30.5m) | |
| Material | Polyaramid Polymetaphenylene Isophthalamide | |
| Features | Flame Retardant, High Temperature | |
| Color | Green | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | NXN1.75GN | |
| Related Links | NXN1, NXN1.75GN Datasheet, Techflex Distributor | |
![]() | CRCW251230K0FKTG | RES SMD 30K OHM 1% 1W 2512 | datasheet.pdf | |
![]() | BCP56-16T3G | TRANS NPN 80V 1A SOT-223 | datasheet.pdf | |
![]() | E3S-AD11 | SENS OPTO REFL 200MM PREWIRE MOD | datasheet.pdf | |
![]() | STEVAL-MKI113V1 | BOARD ADAPTER 24DIP LSM303DLM | datasheet.pdf | |
![]() | RNC55H5560BSBSL | RES 556 OHM 1/8W .1% AXIAL | datasheet.pdf | |
![]() | RWR89S82R5FPS73 | RES 82.5 OHM 3W 1% WW AXIAL | datasheet.pdf | |
![]() | TCAD001 | DEV BOARD PLUS MICROSTICK | datasheet.pdf | |
![]() | G2R-2-SN AC48(S) BY OMB | RELAY | datasheet.pdf | |
![]() | 8N3SV75AC-0139CDI | IC OSC VCXO 170MHZ 6-CLCC | datasheet.pdf | |
![]() | 09693009103 | 5W5_MA_ANG_20 A_S4_BRACKET, CLIP | datasheet.pdf | |
![]() | ICE5LP2K-UWG20ITR | IC FPGA 2048LUTS 1.2V 20WLCS | datasheet.pdf | |
![]() | AKT4B2122032 | KT4 BLACK COVER | datasheet.pdf |