Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-OMAP3503ECBB | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| Product Training Modules | SYS/BIOS RTOS and Software Interrupts SYS/BIOS: Semaphores | |
| Manufacturer Product Page | OMAP3503ECBB Specifications | |
| Standard Package | 168 | |
| Category | Integrated Circuits (ICs) | |
| Family | Embedded - Microprocessors | |
| Series | OMAP-35xx | |
| Packaging | Tray | |
| Core Processor | ARM® Cortex®-A8 | |
| Number of Cores/Bus Width | 1 Core, 32-Bit | |
| Speed | 600MHz | |
| Co-Processors/DSP | Multimedia; NEON™ SIMD | |
| RAM Controllers | LPDDR | |
| Graphics Acceleration | No | |
| Display & Interface Controllers | LCD | |
| Ethernet | - | |
| SATA | - | |
| USB | USB 1.x (3), USB 2.0 (1) | |
| Voltage - I/O | 1.8V, 3.0V | |
| Operating Temperature | 0°C ~ 90°C | |
| Security Features | - | |
| Package / Case | 515-VFBGA, FCBGA | |
| Supplier Device Package | 515-POP-FCBGA (12x12) | |
| Additional Interfaces | HDQ/1-Wire, I²C, McBSP, McSPI, MMC/SD/SDIO, UART | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | OMAP3503ECBB | |
| Related Links | OMAP35, OMAP3503ECBB Datasheet, Texas Instruments Distributor | |
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