Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-P1AFS1500-2FGG484I | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| PCN Design/Specification | DDR Frequency 25/Jan/2013 | |
| Standard Package | 60 | |
| Category | Integrated Circuits (ICs) | |
| Family | Embedded - FPGAs (Field Programmable Gate Array) | |
| Series | Fusion® | |
| Number of LABs/CLBs | - | |
| Number of Logic Elements/Cells | - | |
| Total RAM Bits | 276480 | |
| Number of I/O | 223 | |
| Number of Gates | 1500000 | |
| Voltage - Supply | 1.425 V ~ 1.575 V | |
| Mounting Type | Surface Mount | |
| Operating Temperature | -40°C ~ 100°C | |
| Package / Case | 484-BGA | |
| Supplier Device Package | 484-FPBGA (23x23) | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | P1AFS1500-2FGG484I | |
| Related Links | P1AFS1500, P1AFS1500-2FGG484I Datasheet, Microsemi SoC Distributor | |
![]() | 117-93-642-41-005000 | CONN IC DIP SOCKET 42POS GOLD | datasheet.pdf | |
![]() | HMC06DRAN-S734 | CONN EDGECARD 12POS .100 R/A PCB | datasheet.pdf | |
![]() | TL3016IDR | IC PREC COMP ULTRA-FAST 8-SOIC | datasheet.pdf | |
![]() | FXO-LC738-150 | OSC XO 150.000MHZ LVDS SMD | datasheet.pdf | |
![]() | RAVF104DJT5R10 | RES ARRAY 4 RES 5.1 OHM 0804 | datasheet.pdf | |
![]() | OSTYK22424030 | Connector Barrier Block Strip 24 Circuit 0.250" (6.35mm) | datasheet.pdf | |
![]() | 924217-32-08-EU | CONN HEADER 8POS .100" GOLD | datasheet.pdf | |
![]() | D4SL-N3GFG-D4N | D4SL-N3GFG-D4N | datasheet.pdf | |
![]() | FTLF8519F2KNL | TXRX OPT SFF 2 GB/S 850NM | datasheet.pdf | |
![]() | ATS-17C-50-C2-R0 | HEATSINK 30X30X15MM L-TAB T766 | datasheet.pdf | |
![]() | CRCW080510R0JNEC | RES SMD 10 OHM 5% 1/8W 0805 | datasheet.pdf | |
![]() | 6-1478762-7 | METAL BACKSHELL 25 WAY TOP ENTRY | datasheet.pdf |