Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
Internal Part Number | EIS-P50-030S-R1-EA | |
Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
Production Status (Lifecycle) | In Production | |
Condition | New & Unused, Original Sealed | |
Other Related Documents | Interconnect Mating Guide | |
Standard Package | 208 | |
Category | Connectors, Interconnects | |
Family | Rectangular - Board to Board Connectors - Arrays, Edge Type, Mezzanine | |
Series | Pak 50, P50 | |
Packaging | Bulk | |
Connector Type | Socket, Outer Shroud Contacts | |
Number of Positions | 30 | |
Pitch | 0.050" (1.27mm) | |
Number of Rows | 2 | |
Mounting Type | Through Hole | |
Features | Board Lock, Flange | |
Contact Finish | Gold | |
Contact Finish Thickness | 10µin (0.25µm) | |
Mated Stacking Heights | - | |
Height Above Board | 0.421" (10.70mm) | |
Weight | 0.001 KG | |
Application | Email for details | |
Alternative Part (Replacement) | P50-030S-R1-EA | |
Related Links | P50-030, P50-030S-R1-EA Datasheet, 3M Distributor |
![]() | ERO-S2PHF5113 | RES 511K OHM 1/4W 1% AXIAL | datasheet.pdf | |
![]() | SMAJ6.0A | TVS DIODE 6VWM 10.3VC SMA | datasheet.pdf | |
![]() | RYM06DRST | CONN EDGECARD 12POS DIP .156 SLD | datasheet.pdf | |
![]() | LP339DRE4 | IC QUAD LP DIFF COMPARATR 14SOIC | datasheet.pdf | |
![]() | 4516-1/4 | TAPE VINYL FOAM 1/4" X 36YD | datasheet.pdf | |
![]() | 186E24 | XFRMR LAMINATED 57.6VA CHAS MNT | datasheet.pdf | |
![]() | VE-J1M-EW-S | CONVERTER MOD DC/DC 10V 100W | datasheet.pdf | |
![]() | RNC60H6120DSB14 | RES 612 OHM 1/4W .5% AXIAL | datasheet.pdf | |
![]() | F3SJ-A0345P30 | F3SJ-A0345P30 | datasheet.pdf | |
![]() | 680518-3 | HDM 9SMPR096F110O G | datasheet.pdf | |
![]() | BFC233843153 | CAP FILM 0.015 UF 10% 300 VAC RA | datasheet.pdf | |
![]() | XC4006TMPQ160-5C | IC FPGA 61 I/O 84PLCC | datasheet.pdf |